<strong>CoCrFeMnNi</strong>高熵合金作为中间层的<strong>Cu/304</strong>不锈钢扩散连接研究

doi:10.11900/0412.1961.2019.00404

金属学报

2020, Vol. 56

Issue (8): 1084-1090 DOI: 10.11900/0412.1961.2019.00404

本期目录 | 过刊浏览

CoCrFeMnNi高熵合金作为中间层的Cu/304不锈钢扩散连接研究

丁文, 王小京(

), 刘宁(

), 秦亮

江苏科技大学材料科学与工程学院镇江 212003

Diffusion Bonding of Copper and 304 Stainless Steel with an Interlayer of CoCrFeMnNi High-Entropy Alloy

DING Wen, WANG Xiaojing(

), LIU Ning(

), QIN Liang

School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China

引用本文:

丁文, 王小京, 刘宁, 秦亮. CoCrFeMnNi高熵合金作为中间层的Cu/304不锈钢扩散连接研究[J]. 金属学报, 2020, 56(8): 1084-1090.
Wen DING, Xiaojing WANG, Ning LIU, Liang QIN. Diffusion Bonding of Copper and 304 Stainless Steel with an Interlayer of CoCrFeMnNi High-Entropy Alloy[J]. Acta Metall Sin, 2020, 56(8): 1084-1090.

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摘要:

将CoCrFeMnNi高熵合金作为中间层，采用真空固态扩散方法实现Cu/304不锈钢的连接，通过SEM、EDS以及显微硬度测试，研究温度对扩散反应机理及性能的影响，采用Fick第二定律计算Cu/Fe原子在高熵合金中的扩散系数，借助XRD以及高熵合金中固溶体相形成判据分析扩散界面的相组成。结果表明：在800~900 ℃下，高熵合金与Cu和304不锈钢分别实现了稳固连接，界面处发生了元素的互扩散，随着温度的升高，Cu/Fe在高熵合金中的平均扩散系数增加；Cu/CoCrFeMnNi高熵合金和CoCrFeMnNi高熵合金/304不锈钢扩散界面处均未形成脆性金属间化合物；扩散界面处硬度呈连续变化趋势。研究表明，CoCrFeMnNi高熵合金是一种可用于Cu/304不锈钢异种材料扩散连接的阻挡层材料。

关键词 ：高熵合金, 真空扩散, 扩散速率, 反应机理

Abstract：

During the dissimilar materials bonding of copper and 304 stainless steel, micro-voids and micro-cracks can propagate into the bond region because of Kirkendall effect, and have a strong impact on the mechanical and physical properties of conjunct. Copper and 304 stainless steel was bonded by utilizing vacuum solid-state diffusion method with an interlayer of CoCrFeMnNi high-entropy alloy, and the influence of temperature on diffusion reaction mechanism and properties was investigated by using SEM, EDS and microhardness test. The second Fick's law was adopted to calculate the diffusion coefficient of Cu/Fe in CoCrFeMnNi high-entropy alloy. The phase components of the diffusion interface were detected by XRD, and the famous phase-selection-criteria was also used to discuss the phase formation. The results showed that the diffusion interface was well bonded and all the elements diffused mutually at the temperature range of 800~900 ℃, the diffusion rate of Cu/Fe in CoCrFeMnNi high-entropy alloy was increased with the increasing temperature, and no intermetallic compounds were detected at the diffusion interface, and the microhardness increased continuously near the diffusion interface. It was investigated that CoCrFeMnNi high-entropy alloy can be used as an effective diffusion barriers for dissimilar materials bonding of Cu/304 stainless steel.

Key words： high-entropy alloy vacuum diffusion diffusion rate reaction mechanism

收稿日期: 2019-11-25

ZTFLH:

TG457.1

基金资助:国家自然科学基金项目(51541104);江苏省研究生科研与实践创新计划项目(KYCX19-1674)

作者简介: 丁文，男，1993年生，硕士生

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https://www.ams.org.cn/CN/10.11900/0412.1961.2019.00404 或 https://www.ams.org.cn/CN/Y2020/V56/I8/1084

表1 焊接材料的化学成分 (mass fraction / %)

表2 扩散连接材料所含元素的物化性能参数[25]

图1 不同连接温度时Cu/HEA/304SS扩散界面微观形貌及元素分布

图2 850 ℃时Cu/HEA/304SS扩散偶的XRD谱

图3 不同温度下界面附近显微硬度和850 ℃扩散偶的硬度分布图

表3 不同原子之间的混合焓[25] (kJ·mol-1)

表4 扩散偶不同区域的元素含量

表5 扩散偶参数计算结果

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