二元互不固溶金属合金化的研究进展

doi:10.11900/0412.1961.2019.00451

金属学报

2020, Vol. 56

Issue (6): 801-820 DOI: 10.11900/0412.1961.2019.00451

本期目录 | 过刊浏览

二元互不固溶金属合金化的研究进展

黄远(

), 杜金龙, 王祖敏

天津大学材料科学与工程学院天津 300354

Progress in Research on the Alloying of Binary Immiscible Metals

HUANG Yuan(

), DU Jinlong, WANG Zumin

School of Materials Science and Engineering, Tianjin University, Tianjin 300354, China

引用本文:

黄远, 杜金龙, 王祖敏. 二元互不固溶金属合金化的研究进展[J]. 金属学报, 2020, 56(6): 801-820.
Yuan HUANG, Jinlong DU, Zumin WANG. Progress in Research on the Alloying of Binary Immiscible Metals[J]. Acta Metall Sin, 2020, 56(6): 801-820.

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摘要:

基于二元互不固溶金属体系的材料在航天、核聚变工程、电子封装以及反装甲武器等领域中有着广泛的应用，但由于反应热为正、组元性质差异较大，其直接合金化以及相应的材料制备都十分困难。针对于此，国内外开发了多种用于二元互不固溶金属直接合金化的方法，并对合金化过程的热力学和扩散机制进行了研究。本文首先综述了机械合金化、物理气相沉积和离子束混合3种已有合金化方法的原理、热力学机制及其在二元互不固溶金属粉末合金和纳米多层膜等材料中的应用。然后，介绍了近些年来本研究组提出并发展的辐照损伤诱发合金化、高温结构诱发合金化等新型互不固溶金属合金化方法，详细阐述了这2种方法的原理、合金化界面显微结构、热力学机制、扩散机制和应用。最后，展望了二元互不固溶金属体系合金化研究的发展趋势。

关键词 ：二元互不固溶金属体系, 直接合金化, 热力学机制, 显微结构, 力学性能

Abstract：

Materials based on binary immiscible metal systems are widely used in aerospace, nuclear fusion engineering, electronic packaging, anti-armor weapons and other fields. However, due to the positive formation heat and the large differences in the properties of the component, the direct alloying of binary immiscible metals and the preparation of the corresponding materials are very difficult. Varieties of methods have been developed for direct alloying of binary immiscible metals at home and abroad, and the thermodynamic and diffusion mechanism of these methods have been studied. In this review, firstly the principle and thermodynamic mechanism of mechanical alloying, physical vapor deposition and ion beam mixing, as well as their applications in binary immiscible metal powder alloys and nano-multilayer films are reviewed. Then the irradiation damage alloying (IDA) and high-temperature structure induced alloying (HTSIA) methods that are proposed and developed by our group are introduced. Besides, the principle, interfacial microstructure, thermodynamic mechanism, diffusion mechanism and application of these two methods were described in detail. Finally, the development trend of the research on alloying of binary immiscible metals is proposed.

Key words： binary immiscible metallic alloy direct alloying thermodynamic mechanism microstructure mechanical property

收稿日期: 2019-12-17

ZTFLH:

TG131

基金资助:国家重点研发计划项目(2018YFB0703904);国家重点研发计划项目(2017YFE0302600);国家自然科学基金项目(51471114);国家自然科学基金项目(51171128)

作者简介: 黄远，男，1970年生，教授，博士

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https://www.ams.org.cn/CN/10.11900/0412.1961.2019.00451 或 https://www.ams.org.cn/CN/Y2020/V56/I6/801

图1 大塑性变形的工艺示意图：高压扭转、等通道转角挤压、累积叠轧

图2 物理气沉积示意图

图3 离子束混合示意图

图4 辐照损伤诱发互不固溶金属合金化并制备W/Ag、Mo/Ag和Mo/Cu层状复合材料的工艺流程[100]

图5 W/Ag层状复合材料截面的EDX线扫描结果[100]

图7 Mo/Cu层状复合材料截面的EDX线扫描结果[100,102]

图8 W/Ag层状复合材料的界面结构[100]

图9 Mo/Ag层状复合材料的界面结构[100,101]

图10 Mo/Cu 层状复合材料的界面结构[100]

图11 预退火的纯Mo和经过Ag离子注入的Mo的S参数比较、Mo/Ag层状金属基复合材料在不同温度退火的S参数和S/SB参数[101] (S为Doppler展宽谱的线性参数，SB为被归一化为无缺陷样品的S值)

表1 Mo/Ag双层金属在不同温度下合金化相同时间后的VEPAS测试S参数峰值和峰值相应深度[101]

图6 Mo/Ag层状复合材料截面的EDX线扫描结果[100,101]

图12 Mo/Ag层状复合材料截面的TEM像[101]

图13 Mo/Ag层状试样中的Kirkendall孔洞形成过程[101]

图14 高温结构诱发合金化(HTSIA)制备Nb/Cu棒状复合材料的工艺流程[107]

图15 W/Cu连接件界面显微结构的HRTEM观察结果[109]

图16 球磨30和40 h后在980 ℃烧结3 h制备的W50Cu50粉末的HRTEM像和相应的SAED花样[109]

图17 原始轧制态和退火后的W棒和Cu棒的DSC曲线[109]

图18 W50Cu50球磨粉末烧结前后的DSC曲线[109]

图19 W-Cu体系高温结构诱发合金化过程中的Gibbs自由能变化曲线[109]

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