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退火工艺对硅通孔填充Cu微结构演化与胀出行为的影响* |
陈思,秦飞,安彤(),王瑞铭,赵静毅 |
北京工业大学机械工程与应用电子技术学院, 北京 100124 |
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EFFECTS OF ANNEALING PROCESS ON MICRO-STRUCTURE EVOLUTION AND PROTRUSION OFCOPPER FILLED IN THROUGH-SILICON VIAS |
Si CHEN,Fei QIN,Tong AN(),Ruiming WANG,Jingyi ZHAO |
College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China |
引用本文:
陈思,秦飞,安彤,王瑞铭,赵静毅. 退火工艺对硅通孔填充Cu微结构演化与胀出行为的影响*[J]. 金属学报, 2016, 52(2): 202-208.
Si CHEN,
Fei QIN,
Tong AN,
Ruiming WANG,
Jingyi ZHAO.
EFFECTS OF ANNEALING PROCESS ON MICRO-STRUCTURE EVOLUTION AND PROTRUSION OFCOPPER FILLED IN THROUGH-SILICON VIAS[J]. Acta Metall Sin, 2016, 52(2): 202-208.
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