ANISOTROPIC DEFORMATION BEHAVIOR OF CONTINUOUS COLUMNAR-GRAINED CuNi10Fe1Mn ALLOY

doi:10.11900/0412.1961.2014.00363

Acta Metall Sin

2015, Vol. 51

Issue (1): 40-48 DOI: 10.11900/0412.1961.2014.00363

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ANISOTROPIC DEFORMATION BEHAVIOR OF CONTINUOUS COLUMNAR-GRAINED CuNi10Fe1Mn ALLOY

LIU Yongkang¹, HUANG Haiyou^1,², XIE Jianxin^1,²(

)

1 Key Laboratory for Advanced Materials Processing of Ministry of Education, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083
2 Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083

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LIU Yongkang, HUANG Haiyou, XIE Jianxin. ANISOTROPIC DEFORMATION BEHAVIOR OF CONTINUOUS COLUMNAR-GRAINED CuNi10Fe1Mn ALLOY. Acta Metall Sin, 2015, 51(1): 40-48.

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Abstract

In continuous unidirectional solidification process, an unidirectional heat transfer condition can be established to control grain growth direction along the solidification direction (SD). By this method, continuous columnar-grained (CCG) polycrystalline alloys without transverse grain boundary can be obtained, which possess high orientated texture and straight grain boundary morphology. High orientated texture can significantly improve the consistency among the grains, and the straight grain boundaries reduce the number of coordinated strain components, resulting in high plasticity and excellent extension behavior along the SD in the CCG alloys. For example, the CCG polycrystalline CuNi10Fe1Mn alloy has a high tensile elongation (>40%). However, as described above, the CCG polycrystalline alloy has an extremely anisotropic microstructure. In order to improve its performance, select the appropriate processing methods, and establish a reasonable process, its mechanical properties and deformation behavior were investigated with tensile direction along the SD or perpendicular to the solidification direction (PD) in this work. The electron back-scatter diffraction (EBSD) and digital image correlation (DIC) techniques were introduced to study the effects of microstructure anisotropy on the mechanical properties and deformation behavior. The results indicate that both SD and PD samples have [100] preferred orientation. All grains in SD samples (Taylor factor m=2.17) are nearby [100], while some grains in PD samples (Taylor factor m=2.93) scatter among [001]-[011]. Microstructure characteristics of low orientation dispersion and no horizontal grain boundary in SD samples contribute to the uniform stress distribution and consistent deformation behavior in each grain along the tensile direction. The yield strength, tensile strength and elongation are 85 MPa, 215 MPa and 42%, respectively. Compared to SD samples, PD samples appear to grain boundary stress concentration and zigzag surface morphologies due to the orientation dispersion and horizontal grain boundaries. As a result, the yield strength markedly increases to 115 MPa, and the elongation decreases to 36%. The SD and PD samples occur ductile and mixed fracture, respectively. The anisotropic deformation behavior of CCG polycrystalline CuNi10Fe1Mn alloy is attributed to the anisotropic grain orientation and the grain boundary distribution.

Key words: continuous columnar grain Cu-Ni alloy anisotropy mechanical property deformation behavior

ZTFLH:	TG249.7
	TG146.1

Fund: Supported by National Key Technology Research and Development Program of China (No.2011BAE23B00), National Natural Science Foundation of China (No.51104015) and Independent Research Program of State Key Laboratory for Advanced Metals and Materials (No.2012Z-12)

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	Yongkang LIU
	Haiyou HUANG
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https://www.ams.org.cn/EN/10.11900/0412.1961.2014.00363 OR https://www.ams.org.cn/EN/Y2015/V51/I1/40

Fig.1 Longitudinal (a) and transverse (b) section OM images and XRD spectrum (c) of as-cast continuous columnar-grained (CCG) CuNi10Fe1Mn ingot (SD—solidification direction)

Fig.2 Tensile stress-strain curves of the samples loaded along the solidification direction (SD) and perpendicular to the solidification direction (PD) at room temperature

Fig.3 The surface OM images (a, b) and SEM fracture morphologies (c, d) of SD sample (a, c) and PD sample (b, d)

Fig.4 Nominal stress-strain (σ-ε) curves at room temperature and the insert full-field axial strain images using in situ digital image correlation (DIC) at five typical selected points along the curves (a, b) and the strain distribution along the longitudinal center lines L₁ and L₂(c, d) of SD (a, c) and PD (b, d) samples (The color contour maps stand for magnitudes of local strain Y. The initial tensile zone area is 3 mm×29 mm. Each local strain Y image in two graphs labeled I-V on the σ-ε curves)

Fig.5 The maximum local strain Y_max(a) and the difference value between the maximum and minimum of local strain ΔY (b) in Figs.4c and 4d

Fig.6 Inverse pole figures (IPFs) along SD (a) and PD (b) of CCG CuNi10Fe1Mn alloy, schematic of columnar grain growth orientation (c) and contour lines of Schmid factors in orientation triangle (d)

Fig.7 OM images with inserted grain orientation distribution (a, b) and corresponding EBSD images (c, d) for SD (a, c) and PD (b, d) samples under strain 15% (The miller indices in SD grains are and marked 1, 2 and 3 in Fig.7c, and (105)[01ˉ0] , (013)[03ˉ1] , (017)[07ˉ1] , (148)[02ˉ1] and (001)[1ˉ00]marked 1 to 5 in Fig.7d, TD—tensile direction)

Table 1 Angles between slip bands and tensile direction in each grain of SD and PD samples and Schmid factors under strain 15%

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