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结构变化对\Cu/Sn-58Bi/Cu微焊点电迁移行为和组织演变的影响 |
岳武,秦红波,周敏波,马骁,张新平 |
华南理工大学材料科学与工程学院, 广州 510640 |
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INFLUENCE OF SOLDER JOINT CONFIGURATION ON ELECTROMIGRATION BEHAVIOR AND MICROSTRUCTURAL EVOLUTION OF Cu/Sn-58Bi/Cu MICROSCALE JOINTS |
YUE Wu, QIN Hongbo, ZHOU Minbo, MA Xiao, ZHANG Xinping |
School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640 |
引用本文:
岳武,秦红波,周敏波,马骁,张新平. 结构变化对\Cu/Sn-58Bi/Cu微焊点电迁移行为和组织演变的影响[J]. 金属学报, 2012, 48(6): 678-686.
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INFLUENCE OF SOLDER JOINT CONFIGURATION ON ELECTROMIGRATION BEHAVIOR AND MICROSTRUCTURAL EVOLUTION OF Cu/Sn-58Bi/Cu MICROSCALE JOINTS[J]. Acta Metall Sin, 2012, 48(6): 678-686.
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