金属学报  2011, Vol. 47 Issue (10): 1348-1354    DOI: 10.3724/SP.J.1037.2011.00246

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Cu/X(X=Cr, Nb)纳米多层膜力/电学性能的尺度依赖性

张金钰,张欣,牛佳佳,刘 刚,张国君, 孙 军

西安交通大学金属材料强度国家重点实验室, 西安 710049

LENGTH SCALE DEPENDENT MECHANICAL/ELECTRICAL PROPERTIES OF Cu/X (X=Cr, Nb) NANOSTRUCTURED METALLIC MULTILAYERS

ZHANG Jinyu, ZHANG Xin, NIU Jiajia, LIU Gang, ZHANG Guojun, SUN Jun

State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049

张金钰 张欣 牛佳佳 刘刚 张国君 孙军. Cu/X(X=Cr, Nb)纳米多层膜力/电学性能的尺度依赖性[J]. 金属学报, 2011, 47(10): 1348-1354.
, , , , . LENGTH SCALE DEPENDENT MECHANICAL/ELECTRICAL PROPERTIES OF Cu/X (X=Cr, Nb) NANOSTRUCTURED METALLIC MULTILAYERS[J]. Acta Metall Sin, 2011, 47(10): 1348-1354.

摘要 参考文献 相关文章 Metrics 全文: PDF(1074 KB)   摘要: 利用纳米压痕实验以及四探针法, 系统研究了相同层厚Cu/X(X=Cr, Nb)纳米金属多层膜的力学性能(强/硬度)和电学性能(电阻率)的尺度依赖性. 微观分析表明: Cu/X(多层膜调制结构清晰, Cu层沿{111}面择优生长, X(层沿{110}面择优生长.纳米压入结果表明, Cu/X(多层膜的强度依赖于调制周期, 并随调制周期的减小而增加. 多层膜变形机制在临界调制周期(λc≈25 nm)由Cu层内单根位错滑移转变为位错切割界面. 多层膜的电阻率不仅与表面/界面以及晶界散射相关, 而且在小尺度下受界面条件显著影响. 通过修正的FS-MS模型可以量化界面效应对多层膜电阻率的影响. Cu/$X$纳米多层膜可以通过调控微观结构实现强度-电导率的合理匹配. 关键词 ： Cu/Cr,  Cu/Nb,  纳米多层膜,  强度,  电阻率,  尺寸效应     Abstract：By using nanoindentation test and four point probe method, the length scaled dependent mechanical property (hardness/strength) and electrical property (resistivity) of Cu/X(X=Cr, Nb) nanostructured metallic multilayers with equal individual layer thickness were systematically investigated. It is revealed from the microstructural analysis that the modulation structure of Cu/X metallic multilayers is clear, and the preferred growth planes of Cu layer and X layer are {111} and {110}, respectively. The indentation test shows that the hardness/strength of the multilayers increases with reducing modulation period λ. The deformation mechanism of the multilayers transits from the glide of single dislocation in a Cu layer to the interface cutting at a critical modulation period λc (λc ≈25 nm). The resistivity of Cu/X multilayers is not only related to the scattering of conduction electrons at surfaces/interfaces and grain boundaries, but also affected by the interface condition at small scale. This significant interface effect on the length scale–dependent resistivity is assessed using a modified FS–MS model. The best combination of strength–resistivity can be achieved by tailoring the microstructure of Cu/X nanostructured metallic multilayers. Key words： Cu/Cr    Cu/Nb    nanostructured multilayer    strength    resistivity    size effect 收稿日期: 2011-04-19      基金资助: 国家重点基础研究发展计划项目2010CB631003和国家自然科学基金项目50971097资助 作者简介: 张金钰, 男, 1982年生, 博士生 服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 张金钰 张金钰 刘刚 张国君 孙军 44.8K 链接本文: https://www.ams.org.cn/CN/10.3724/SP.J.1037.2011.00246      或      https://www.ams.org.cn/CN/Y2011/V47/I10/1348 [1] Spearing S M. Acta Mater, 2000; 48: 179 [2] Suo Z G, Vlassak J, Wagner S. China Particuology, 2005; 3: 321 [3] Bakonyi I, P´eter L. Prog Mater Sci, 2010; 55: 107 [4] Was G S, Foecke T. Thin Solid Films, 1996; 286: 1 [5] Li Y P, Zhang G P. Acta Mater, 2010; 58: 3877 [6] Wang M, Zhang B, Zhang G P, Yu Q Y, Liu C S. J Mater Sci Technol, 2009; 25: 699 [7] Misra A, Krug H. Adv Eng Mater, 2001; 3: 217 [8] Misra A, Hirth J P, Hoagland R G. Acta Mater, 2005; 53: 4817 [9] Fu E G, Li N, Misra A, Hoagland R G, Wang H, Zhang X. Mater Sci Eng, 2008; A493: 283 [10] McKeown J, Misra A, Kung H, Hoagland R G, Nastasi M. 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