纳米金属层状材料强塑性的界面调控

doi:10.11900/0412.1961.2021.00402

金属学报

2022, Vol. 58

Issue (6): 709-725 DOI: 10.11900/0412.1961.2021.00402

综述

本期目录 | 过刊浏览

纳米金属层状材料强塑性的界面调控

郑士建¹(

), 闫哲¹, 孔祥飞², 张瑞丰³

^1.河北工业大学材料科学与工程学院天津市材料层状复合与界面控制技术重点实验室天津 300401
^2.有研工程技术研究院有限公司异质连接材料与技术研究所北京 101407
^3.北京航空航天大学材料科学与工程学院北京 100191

Interface Modifications on Strength and Plasticity of Nanolayered Metallic Composites

ZHENG Shijian¹(

), YAN Zhe¹, KONG Xiangfei², ZHANG Ruifeng³

^1.Tianjin Key Laboratory of Materials Laminating Fabrication and Interface Control Technology, School of Materials Science and Engineering, Hebei University of Technology, Tianjin 300401, China
^2.Institute of Heterogeneous Bonding Materials and Technologies, GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China
^3.School of Materials Science and Engineering, Beihang University, Beijing 100191, China

引用本文:

郑士建, 闫哲, 孔祥飞, 张瑞丰. 纳米金属层状材料强塑性的界面调控[J]. 金属学报, 2022, 58(6): 709-725.
Shijian ZHENG, Zhe YAN, Xiangfei KONG, Ruifeng ZHANG. Interface Modifications on Strength and Plasticity of Nanolayered Metallic Composites[J]. Acta Metall Sin, 2022, 58(6): 709-725.

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摘要:

纳米金属层状材料具有优异的力学性能、抗辐照损伤性能和热稳定性,在诸多领域有着广阔的应用前景。但强度的上升往往伴随着塑性的降低,如何有效地平衡层状材料强度与塑性之间的矛盾,仍是目前层状材料界面设计的巨大挑战。当层厚减小至纳米尺度,界面所占比重大幅上升,可动位错的密度急剧降低,界面成为塑性变形的源头。因此研究界面结构与其塑性变形行为之间的关系,是理解纳米层状金属材料微观变形机制及其对力学性能影响的关键。结合目前国内外纳米金属层状材料研究的最新进展,本文以常见层状材料体系为例,系统阐述了界面强化机制、界面结构、界面主导的强度及塑性变形行为和主要界面调控方法等关键科学问题,并对层状材料界面研究发展趋势进行了展望。

关键词 ：纳米金属层状材料, 界面, 位错, 孪生, 强度和塑性

Abstract：

Nanolayered metallic composites exhibit many extraordinary properties, such as high strength, high radiation damage resistance, and good thermal stability. Therefore, it has broad potential applications in many fields. However, similar to other nanocrystalline metallic materials, the strength-ductility trade-off in nanolayered metallic composites is significant. Therefore, how to effectively balance the strength and ductility of nanolayered metallic composites is still a huge challenge in interface engineering. When the layer thickness is reduced to the nanoscale, the proportion of the interface increases substantially, and the density of mobile dislocations in grains decreases sharply, at the same time interface becomes the main source of plastic deformation. Thus, research into the relationship between the interface structure and its plastic behaviors is the key to understanding the microdeformation mechanisms of nanolayered metallic composites and their influence on mechanical properties. Based on the latest research progress, taking typical nanolayered metallic composites as examples, the key points, such as strengthening mechanisms, interface structures, plastic behaviors, and interface design methods are disscussed, and the prospects for future research trends are proposed. This review provides theoretical guidance for developing high-strength and high-ductility nanolayered metallic composites via interface engineering.

Key words： nanolayered metallic composite interface dislocation twin strength and plasticity

收稿日期: 2021-09-18

ZTFLH:

TB331

基金资助:国家自然科学基金项目(51771201);国家自然科学基金项目(52071124);河北省自然科学基金重点项目(E2021202135);天津市自然科学基金重点项目(20JCZDJC00440);东北大学轧制技术与连轧自动化国家重点实验室开放课题(2020RALKFKT002)

作者简介: 郑士建,男,1980年生,教授,博士

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https://www.ams.org.cn/CN/10.11900/0412.1961.2021.00402 或 https://www.ams.org.cn/CN/Y2022/V58/I6/709

图1 不同组元层状材料硬度与单层厚度的关系[29,32,38,48]

图2 不同层厚下层状材料强度的位错机制示意图[13]

图3 物理气相沉积(PVD)法制备的Cu{111}//{110}Nb界面HRTEM像[57]

图4 Cu{111}//{110}Nb界面弛豫后的错配位错结构[61]

图5 Cu{111}//{111}Ni界面特征[34]

图6 弛豫后的Cu{111}//{111}Ni界面[63]

图7 Cu{111}//{0001}Zr界面特征[65,66]

图8 Mg{0001}//{110}Nb界面PS和B取向界面位错组态[68]

图9 Cu{111}//{111}Ag界面[44]

System	Crystal structure	Lattice mismatch / %	Orientation relationship		Dislocation type
Cu/Nb	fcc/bcc	11.1	Cu{111}//{110}Nb	Cu〈110〉//〈111〉Nb	2
			Cu{111}//{110}Nb	Cu〈110〉//〈100〉Nb	7
Cu/Ni	fcc/fcc	2.7	Cu{001}//{001}Ni	Cu $[110]$ // $[110]$ Ni	1
			Cu{111}//{111}Ni	Cu $[1 1 ¯ 0]$ // $[1 1 ¯ 0]$ Ni	3
			Cu{111}//{111}Ni	Cu $[1 1 ¯ 0]$ // $[1 ¯ 10]$ Ni	3
Cu/Ag	fcc/fcc	12.3	Cu{111}//{111}Ag	Cu $[1 1 ¯ 0]$ // $[1 1 ¯ 0]$ Ag	3
			Cu{111}//{111}Ag	Cu $[1 1 ¯ 0]$ // $[1 ¯ 10]$ Ag	3
Cu/Zr	fcc/hcp	20.7	Cu{111}//{0001}Zr	Cu $[1 ¯ 10]$ // $[11 2 ¯ 0]$ Zr	3
Mg/Nb	hcp/bcc	11.1	Mg{0001}//{110}Nb	Mg $[2 1 ¯ 1 ¯ 0]$ // $[111]$ Nb	3
			Mg{0001}//{110}Nb	Mg $[2 1 ¯ 1 ¯ 0]$ // $[100]$ Nb	3

表1 不同体系层状材料界面结构对比

图10 累积叠轧(ARB)法制备的Cu/Nb界面[71]

图11 位错-晶界交互作用的4种交互模式[76]

图12 K-S取向Cu{111}//{110}Nb界面对应的位错形核特征[79]

图13 Cu{111}//{111}Ni界面在剪切下的错合度分析图[69]

图14 冲击加载后的PVD Cu/Nb界面HRTEM像[96]

图15 包含原子台阶的K-S Cu{111}//{110}Nb界面模型[97]

图16 Cu1 - x Ag x//Ag界面模型[101]

图17 包含3D界面和CuNb非晶层的Cu/Nb层状材料TEM像[113,114]

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