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| 纳米压痕法测量Cu膜的硬度和弹性模量 |
| 黎业生1), 汪伟2) |
1) 江西理工大学材料与化学工程学院, 赣州 341000
2) 中国科学院金属研究所材料科学国家(联合)实验室, 沈阳 110016 |
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| MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION |
| LI Yesheng1), WANG Wei2) |
1) School of Materials Science and Chemical Engineering, Jiangxi University of Science and Technology, Ganzhou 341000
2) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 |
引用本文:
黎业生 汪伟. 纳米压痕法测量Cu膜的硬度和弹性模量[J]. 金属学报, 2010, 46(9): 1098-1102.
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MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION[J]. Acta Metall Sin, 2010, 46(9): 1098-1102.
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(张泰华, 待发表) |
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