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Oxidation behavior of fine copper powder between 250-400℃ |
Guo Yan-Hui;Nan Zhang;Jizhong Chen |
浙江大学 |
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Cite this article:
Guo Yan-Hui; Nan Zhang; Jizhong Chen. Oxidation behavior of fine copper powder between 250-400℃. Acta Metall Sin, 2008, 44(7): 821-825 .
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Abstract In this paper, the morphology and structure change of fine copper powder during its oxidization process was observed by SEM and TEM. And their weight gain processes were measured by Thermal gravity Analyser(TGA). Based on the experiments and some classical theories, the course of the oxidation of fine copper powder was proposed. Then a new kinetics equation was deduced to simulate the course. The analog results agree well with the data gained from the oxidation of copper between 250-400℃.
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Received: 15 October 2007
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