Abstract ABSTRACT Sn3.8Ag0.7Cu alloys containing Ag3Sn intermetallic compound (IMC) with different morphology, size and distribution were prepared by controlling cooling rate in solidification and equal channel angle pressing process (ECAP) and, the relation between mechanical properties and IMC phase of the alloys was investigated. The tensile stress-strain curves of different microstructures were compared and the deformed microstructures were observed by SEM and TEM. While the large needle-like Ag3Sn was found to provide fiber-strengthening effect to the alloy, its brittle cracking promoted void nucleation, resulting in a deterioration of tensile elongation. The fine particles of Ag3Sn produced by ECAP enhanced dispersion strengthening by blocking the dislocation motion. The particles on the boundaries of fine equiaxed Sn grains inhibited the grain boundary sliding, leading to improve the tensile strength.
[1] Plumbridge W J．J Mater Sci,1996;31:2501 [2] Abtew M,Selvaduray G．Mater Sci Eng,2000;R27:95 [3] Glazer J．Int Mater Rev,1995;40(2):65 [4] Zeng K,Tu K N．Mater Sci Eng,2002;R38:55 [5] Suganuma K．Curr Opin Solid State Mater Sci,2001;5: 55 [6] Kim K S,Huh S H,Suganuma K．Mater Sci Eng,2002; A333:106 [7] Kanchanomai C,Miyashita Y,Mutoh Y．J Electron Mater,2002;31:456 [8] Moon K W,Boettinger W J,Kattner U R,Biancaniello F S．Handwerker C A．J Electron Mater, 2000; 29:1122 [9] Ochoa F,Williams J J,Chawla N．J Electron Mater,2003; 32:1414 [10] Lehman L P, Athavale S N,Fullem T Z,Giamis A C, Kinyanjui R K,Lowenstein M,Mather K,Patel R,Rae D,Wang J,Xing Y,Zavalij L, Borgesen P, Gotts E J. J Electron Mater,2004;33:1429 [11] Segal V M．Mater Sci Eng,1995;A197:157 [12] Valiev R z,Islamgaliev R K,Alexandrov I V．Prog Mater Sci, 2000;45:103 [13] McCormack M,Jin S,Kammlott G W, Chen H S．Appl Phys Lett, 1993;63:15 [14] Kerr M,Chawla N．Acta Mater,2004;52:4527 [15] McCormack M,Jin S．J Electron Mater,1994; 23:7l5 [16] Cheng Y W,Siewert T．J Electron Mater,2003;32:535 [17] Wu K,Wade N,Cui J,Miyahara K．J Electron Mater, 2003;32:5 [18] Paul T V,Jerome A R,Alice C K．J Electron Mater, 2003; 32:142 [19] Mei Z,Morris J W,Shine M C,Summers T S E．J Eleetron Mater,1991;20:599 [20] Vastava R B,Langdon T G．Acta Metall,1979;27:25l [21] Valiev R z,Langdon T G．Acta Metall Mater, 1993;41: 949
