Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection

doi:10.11900/0412.1961.2022.00593

Acta Metall Sin

2023, Vol. 59

Issue (6): 744-756 DOI: 10.11900/0412.1961.2022.00593

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Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection

GUO Fu(

), DU Yihui, JI Xiaoliang, WANG Yishu

Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China

Cite this article:

GUO Fu, DU Yihui, JI Xiaoliang, WANG Yishu. Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection. Acta Metall Sin, 2023, 59(6): 744-756.

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Abstract

Over the past few decades, electronic products have evolved towards miniaturization, intelligence, and multi-functionality. With the rapid development of new energy vehicles and 5G mobile communication technologies, solder, the most commonly used interconnecting material in the microelectronic industry, may continuously undergo alternating temperature excursions. As a result, researchers have focused on improving the thermomechanical reliability of solder joints. For several decades, researchers have widely studied Sn-based lead-free solder and have established that adding an alloying element or foreign reinforcement can overcome the limitations of traditional Sn-based binary/ternary solder, resulting in highly reliable solder joints. Recently, the interest in Sn-based alloys and composite solders has increased due to their improved mechanical performance. However, various concerns, such as high manufacturing costs, microstructural heterogeneity, and incomplete reliability data. This paper reviews the latest research progress on Sn-based lead-free solders for microelectronic interconnection over the past five years, in particular Sn-based multi-element alloys and composite solders. First, the advantages and disadvantages of typical solder preparation methods are compared and discussed. Second, the effects of an alloying element or foreign reinforcement additions on the solder's microstructure, properties, and thermomechanical reliability are summarized. Finally, this paper presents the main problems in preparing and investigating Sn-based lead-free solders and proposes tentative solutions. The aim is to provide an essential basis for understanding the current development and future research directions for fast-evolving future application scenarios.

Key words: microelectronic interconnection Sn-based lead-free solder microstructure and property thermo-mechanical reliability

Received: 21 November 2022

ZTFLH:

TG425.1

Fund: National Natural Science Foundation of China(52001013);China Postdoctoral Science Foundation(2022M710271);Research and Development Program of Beijing Municipal Education Commission(KZ202210005002);Research and Development Program of Beijing Municipal Education Commission(KM202310005011)

Corresponding Authors: GUO Fu, professor, Tel:13911892016, E-mail: guofu@bjut.edu.cn

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Fig.1 CeO₂ nanoparticles on the surface of an SAC0307-0.3CeO₂ solder matrix^[21]

Fig.2 Temperature profile of Sn-based solder with added Cr^[31] (RT—room temperature)

Fig.3 Schematic showing the alloy vacuum melting method^[35]

Fig.4 Distribution of ZnO nanoparticles within the SAC305-ZnO solder^[36]

Fig.5 TEM image of multi-walled carbon nanotubes (MWCNTs) coated by Ag nanoparticles^[80]

Table 1 Addition amount corresponding to properties deterioration caused by metal modified non-metallic reinforcement agglomeration^{[30,72,73,80-96]}

Fig.6 Illustrations of intermetallic compounds (IMCs) growth in solder matrix during thermal cycling^[107] (TC—thermal cycling, NP—nanoparticle)

Fig.7 Schematic of the fracture pathway for SAC0307-0.06Pr/Cu and SAC0307-0.06Pr-0.06Al₂O₃/Cu solder joint after aging treatment for 840 h^[108]

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