|
|
EFFECT OF TEMPERATURE ON MICROSTRUCTURE AND NANOINDENTATION MECHANICAL PROPERTIES OF ELECTRODEPOSITED NANO-TWINNED Ni |
CHENG Yuhao, ZHANG Yuefei, MAO Shengcheng, HAN Xiaodong, ZHANG Ze |
1) Institute of Microstructure and Properties of Advanced Materials, Beijing University of Technology, Beijing 100124
2) Department of Materials Science, Zhejiang University, Hangzhou 310058 |
|
Cite this article:
CHENG Yuhao ZHANG Yuefei MAO Shengcheng HAN Xiaodong ZHANG Ze. EFFECT OF TEMPERATURE ON MICROSTRUCTURE AND NANOINDENTATION MECHANICAL PROPERTIES OF ELECTRODEPOSITED NANO-TWINNED Ni. Acta Metall Sin, 2012, 48(11): 1342-1348.
|
Abstract The nanocrystalline nickel thin films with high density nano-scale growth twins were synthesized by means of pulse electrodeposition technology. Three samples were deposited at different bath temperatures of 30, 50 and 80 ℃, by keeping all the other parameters as constant, such as electrolyte, pH value, current density and on-time and off-time period. The effect of temperature on deposition rate, sample texture, grain size, and twin boundary length and twin lamella thickness were systematically analyzed by SEM, XRD and TEM techniques. The microscopical feature of twin boundary were investigated by HRTEM. The results show that the nano-twinned nickel films deposited at the rates ranging from 20 nm/s to 30 nm/s have a preferred growth plane of (220) when deposited at 30 and 50 ℃, but changes to (200) when the temperature increases to 80 ℃. With increasing temperature, the grain size decreases from 900 to 300 nm, and the twin lamella thickness decreases from 60 to 28 nm. The relationship between deposition temperature and nanoindentation hardness for these films, moreover was determined. The nanoindentation hardness measurement indicates that the average indentation hardness of these films reaches a maximum value of 3.75 GPa at 50 ℃.
|
Received: 28 June 2012
|
|
Fund: Supported by National Natural Science Foundation of China (Nos.10904001 and 51001003) and Key Project Funding Scheme of Beijing Municipal Education Committee (No.KZ201010005002) |
[1] Christian J W, Mahajan S. Prog Mater Sci, 1995; 39: 1[2] Lu L, Shen Y F, Chen X H, Qian L H, Lu K. Science, 2004; 304: 422[3] Shen Y F, Lu L, Lu Q H, Jin Z H, Lu K. Scr Mater, 2005; 52: 989[4] Lu L, Chen X, Huang X, Lu K. Science, 2009; 323: 30[5] Li X Y, Wei Y J, Lu L, Lu K, Gao H J. Nature, 2010; 464: 877[6] Lu K, Lu L, Suresh S. Science, 2009; 324: 349[7] Lu L, Lu K. Acta Metall Sin, 2010; 46: 1422(卢磊, 卢柯. 金属学报, 2010; 46: 1422)[8] Zhang Y F, Cheng Y H, Han X D, Zhang Z. Chin Pat, 201220267938.6, 2011(张跃飞, 成宇浩, 韩晓东, 张泽. 中国专利, 201220267938.6, 2011)[9] Cheng Y H, Zhang Y F, Mao S C, Han X D, Zhang Z. J Chin Electro Microsc Soc , 2011; (Suppl): 45(成宇浩, 张跃飞, 毛圣成, 韩晓东, 张泽. 电子显微学报, 2011; (增刊): 45)[10] Zhang X, Wang H, Chen y H, Lu L, Lu K, Hoagland R G, Misra A. Appl Phys Lett, 2006; 88: 173116[11] Anderoglu O, Misra A, Wang H, Ronning F, Hundley M F, Zhang X. Appl Phys Lett, 2008; 93: 083108[12] Yan F, Zhang H W, Tao N R, Lu K. J Mater Sci Technol, 2011; 27: 673[13] Hong C S, Tao N R, Huang X, Lu K. Acta Mater, 2010; 58: 3103[14] Tao N R, Lu K. J Mater Sci Technol, 2007; 23: 771[15] Tu Z M, Li N, Hu H L, Cao L X. Electrodeposited Nanocrystalline Material Technology. Beijing: National Defense Industry Press, 2008: 66(屠振密, 李宁, 胡会利, 曹立新. 电沉积纳米晶体材料技术. 北京: 国防工业出版社, 2008: 66)[16] Chen T Y. Nickel Plating Fault Handling and Examples. Beijing: Chemical Industry Press, 2010: 4(陈天玉. 镀镍故障处理及实例. 北京: 化学工业出版社, 2010: 4)[17] Peng X, Yan J, Xu C. Metall Mater Trans, 2008; 39A: 119[18] Motoyama M, Fukunaka Y, Sakka T, Ogata Y H. J Electrochem Soc, 2006; 153: C502[19] Lucadamo G, Medlin D L, Yang N Y C, Kelly J J, Talin A A. Philos Mag, 2005; 85: 2549[20] El.Sherik A M, Erb U. J Mater Sci, 1995; 30: 5743[21] Saitou M, Oshiro S, Asadul H S M. J Appl Electrochem, 2008; 38: 309[22] Bicelli L P, Bozzini B, Mele C, D乫Urzo L. Int J Electrochem Sci, 2008; 3: 356[23] Fleischmann M, Thirsk H R. Electrochim Acta, 1959; 1: 146[24] Boubatra M, Azizi A, Schmerber G, Dinia A. Ionics, 2012; 15: 425[25] Boubatra M, Azizi A, Schmerber G, Dinia A. J Mater Sci.Mater Electron, 2011; 22: 1804[26] Swygenhoven H V, Derlet P M, Fr冇seth A G. Nat Mater, 2004; 3: 399[27] Idrissi H, Wang B, Colla M S, Raskin J P, Schryvers D, Pardoen T. Adv Mater, 2011; 23: 2119[28] Zhu T, Gao H. Scr Mater, 2012; 66: 843 |
No Suggested Reading articles found! |
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|