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Acta Metall Sin  2018, Vol. 54 Issue (7): 1051-1058    DOI: 10.11900/0412.1961.2017.00411
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Research of Surface Defects of Polycrystalline Copper Nanoindentation Based on Microstructures
Pengyue ZHAO1,2, Yongbo GUO1(), Qingshun BAI1, Feihu ZHANG1
1 Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China
2 State Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin 150001, China
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In the present technology, the manufacture of micro-electro-mechanical system (MEMS) and nano-electro-mechanical system (NEMS) are limited by the lack of mechanism of material processing, especially the mechanism of the polycrystalline materials. In this work, based on the microstructures of polycrystalline copper, the evolution mechanism of dislocations on the polycrystalline copper nanoindentation surface is researched by the four types of microstructures in polycrystalline materials, including grain cell, grain boundary, triple junction and vertex points. In addition, the coordination number, internal stress and atomic potential energy of the dislocations defects are also considered. The results show that when the microstructures with high dimension number carry the compressive stress, the adjacent microstructures with low dimension number appear tensile stress and the microstructures with lower dimension number like vertex points is more likely to appear tensile stress. The dislocation atoms accumulate high internal stress and atomic potential energy during the dislocation nucleation. The internal stress of the imperfect dislocation atoms at the dislocation edge is higher than that of the stacking layer atoms inside the dislocations during the dislocation growth. The process of nucleation and growth, and the internal stress accumulation and release both have similar directionality. They both firstly extended to the microstructures with lower dimension number like vertex points and triple junction, and then expend to and stop at the grain boundary with high dimension number.

Key words:  polycrystalline copper      microstructure      nanoindentation      molecular dynamics     
Received:  26 September 2017     
ZTFLH:  TG301  
Fund: Supported by National Science Foundation for Young Scientists of China (No.51405111) and National Natural Science Foundation of China (No.51535003 )

Cite this article: 

Pengyue ZHAO, Yongbo GUO, Qingshun BAI, Feihu ZHANG. Research of Surface Defects of Polycrystalline Copper Nanoindentation Based on Microstructures. Acta Metall Sin, 2018, 54(7): 1051-1058.

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Fig.1  3D model of polycrystalline copper (a), and 3D model of single compressed grain with probe (b) showing nanoindentation molecular dynamics (MD) model
Fig.2  Indentation force-indentation depth curves for polycrystalline copper nanoindentation (Inset shows the nanoindentation force in Y axis with nanoindentation depths from 0 to 0.25 nm)
Fig.3  Top view of single grain with nanoindentation depth of 5 nm (a), and front views of single grain with nanoindentation depths of 1 nm (b), 2 nm (c), 3 nm (d) and 4 nm (e) showing nucleation and propagation of dislocations (CSP—center-symmetry parameter)
Fig.4  Top view of single grain with nanoindentation depth of 5 nm (a), and front views of single grain with nanoindentation depths of 1 nm (b), 2 nm (c), 3 nm (d) and 4 nm (e) showing hydrostatic stress (HY) distributions
Fig.5  Top view of single grain with nanoindentation depth of 5 nm (a), and front views of single grain with nanoindentation depths of 1 nm (b), 2 nm (c), 3 nm (d) and 4 nm (e) showing von Mises stress (VM) distributions
Fig.6  Front views of dislocations with nanoindentation depth of 0.6 nm (a, f, k), 0.8 nm (b, g, l), 1.0 nm (c, h, m), 1.2 nm (d, i, n), 1.4 nm (e, j, o) showing hydrostatic stress (HY) distributions (a~e), von Mises stress (VM) distributions (f~j) and potential energy (PE) distributions (k~o) during dislocation evolution process
Fig.7  Average CSP-indentation depth curves for microstructures in single grain
Fig.8  HY-indentation depth curves for microstructures in single grain
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