电流强度对冷坩埚定向凝固Ni<sub>3</sub>Al金属间化合物微观组织的影响

doi:10.11900/0412.1961.2017.00099

金属学报

2017, Vol. 53

Issue (11): 1461-1468 DOI: 10.11900/0412.1961.2017.00099

研究论文

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电流强度对冷坩埚定向凝固Ni₃Al金属间化合物微观组织的影响

王国田, 丁宏升(

), 陈瑞润, 郭景杰, 傅恒志

哈尔滨工业大学材料科学与工程学院金属精密热加工国家重点实验室哈尔滨 150001

Effect of Current Intensity on Microstructure of Ni₃Al Intermetallics Prepared by Directional Solidification Electromagnetic Cold Crucible Technique

Guotian WANG, Hongsheng DING(

), Ruirun CHEN, Jingjie GUO, Hengzhi FU

National Key Laboratory for Precision Hot Processing of Metals, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China

引用本文:

王国田, 丁宏升, 陈瑞润, 郭景杰, 傅恒志. 电流强度对冷坩埚定向凝固Ni₃Al金属间化合物微观组织的影响[J]. 金属学报, 2017, 53(11): 1461-1468.
Guotian WANG, Hongsheng DING, Ruirun CHEN, Jingjie GUO, Hengzhi FU. Effect of Current Intensity on Microstructure of Ni₃Al Intermetallics Prepared by Directional Solidification Electromagnetic Cold Crucible Technique[J]. Acta Metall Sin, 2017, 53(11): 1461-1468.

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摘要:

为改善Ni₃Al合金的室温塑性,研究了不同电流强度的直流电场对冷坩埚定向凝固Ni₃Al合金微观组织的影响。结果表明,在直流电场作用下,随着电流强度的增加,Ni₃Al合金的定向凝固组织的一次枝晶间距变小,凝固界面变得平直。未施加直流电流时,凝固组织由L1₂型结构的Ni₃Al基体和B2型结构的NiAl析出相两相组成。当定向凝固过程中施加直流电流时,凝固组织中析出相由B2型NiAl相转变为呈薄层状、晶面对称的孪晶马氏体NiAl相。

关键词 ： Ni₃Al, 金属间化合物, 直流电场, 定向凝固, 微观组织

Abstract：

Due to their excellent high-temperature strength, and good oxidation resistance, Ni₃Al-based alloys have long attracted considerable interest as a class of high-temperature structural material. These properties, combined with their unique high thermal conductivity, make them ideal for special applications, such as blades in gas turbines and jet engines. However, polycrystalline Ni₃Al alloys show almost no ductility and extremely low fracture resistance at ambient temperatures. Ni₃Al alloys with the high ductility at room-temperature can be adjusted by the microstructure through directional solidification (DS) and matching. It has been shown that the electric field can refine the solidification structure, reduce the dendrite spacing, promote the diffusion and change the solute redistribution in the solidification process. In order to improve the room temperature ductility of Ni₃Al alloy, the effect of current intensity on microstructure of DS Ni-25Al alloy is investigated. In this work, the effects of constant current intensity and NiAl phase on the microstructure are researched. The results show that in the DC electric field, as the result of the aggregation of current along dendrite tip and the Joule heat at the tip of dendrite, the primary dendritic spacing (λ) decreases with the increasing of current intensity. And the solid-liquid interface tends to be straight resulting from the Joule heat and Peltier effect caused by the segregation of current and the difference in conductivity between solid and liquid interface. When no direct current is applied the DS samples contain the L1₂ structure of Ni₃Al matrix and B2 structure of NiAl precipitate phase. The microstructure is a duplex structure which consist of gray Ni₃Al matrix and black NiAl precipitates. NiAl precipitates with regular shape and has obvious orientation along with the growth direction. When the DC current is applied, NiAl precipitates is irregular and dispersion and has no obvious directionality, due to Joule heat effect generated by the current effect, the undercooling increased and the precipitated NiAl phase transformed into thin martensite NiAl phase with twin crystal symmetry from the NiAl-B2 type structure.

Key words： Ni₃Al intermetallics DC electric field directional solidification microstructure

收稿日期: 2017-03-27

ZTFLH:

TG244.3

基金资助:国家自然科学基金项目No.51471062

作者简介:

作者简介王国田,男,1978年生,博士生

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https://www.ams.org.cn/CN/10.11900/0412.1961.2017.00099 或 https://www.ams.org.cn/CN/Y2017/V53/I11/1461

图1 电磁连续铸造设备示意图

图2 不同电流强度下定向凝固Ni3Al合金的XRD谱

图3 不同电流强度作用下定向凝固Ni3Al合金微观组织的SEM像

图4 不同电流强度作用下定向凝固Ni3Al合金片层组织的SEM像

图5 电流强度为0 A时定向凝固Ni3Al的TEM像和SAED花样

图6 电流强度为15 A时定向凝固合金中NiAl的SAED花样

图7 电流强度为20 A时定向凝固合金中NiAl相的TEM像和SAED花样

图8 不同电流强度下定向凝固Ni3Al试棒凝固界面的宏观形貌

图9 电流强度与下凹深度Δh的关系

图10 不同电流强度作用下定向凝固Ni3Al试样横截面组织的OM像

图11 一次枝晶间距随电流强度的变化规律

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