|
|
Sn/Cu互连体系界面金属间化合物Cu6Sn5演化和生长动力学的相场法模拟* |
柯常波1,2( ), 周敏波2, 张新平2 |
1 华南理工大学机械与汽车工程学院, 广州 510640 2 华南理工大学材料科学与工程学院, 广州 510640 |
|
PHASE FIELD SIMULATION ON MICROSTRUCTURE EVOLUTION AND GROWTH KINETICS OF Cu6Sn5 INTERMETALLIC COMPOUND DURING EARLY INTERFACIAL REACTION IN Sn/Cu SOLDERING SYSTEM |
KE Changbo1,2( ), ZHOU Minbo2, ZHANG Xinping2 |
1 School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640 2 School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640 |
引用本文:
柯常波, 周敏波, 张新平. Sn/Cu互连体系界面金属间化合物Cu6Sn5演化和生长动力学的相场法模拟*[J]. 金属学报, 2014, 50(3): 294-304.
Changbo KE,
Minbo ZHOU,
Xinping ZHANG.
PHASE FIELD SIMULATION ON MICROSTRUCTURE EVOLUTION AND GROWTH KINETICS OF Cu6Sn5 INTERMETALLIC COMPOUND DURING EARLY INTERFACIAL REACTION IN Sn/Cu SOLDERING SYSTEM[J]. Acta Metall Sin, 2014, 50(3): 294-304.
[1] |
Abtew M, Selvaduray G. Mater Sci Eng, 2000; R27: 95
|
[2] |
Yin L M, Yang Y, Liu L Q, Zhang X P. Acta Metall Sin, 2009; 45:422
|
[2] |
(尹立孟, 杨 艳, 刘亮岐, 张新平. 金属学报, 2009; 45: 422)
|
[3] |
Zhou M B, Ma X, Zhang X P. J Mater Sci Mater Electron, 2012; 23: 1543
|
[4] |
Zeng K, Tu K N. Mater Sci Eng, 2002; R38: 55
|
[5] |
Zuruzi A S, Chiu C H, Lahiri S K, Tu K N. J Appl Phys, 1999; 86: 4916
|
[6] |
Deng X, Piotrowski G, Williams J J, Chawla N. J Electron Mater, 2003; 32: 1403
|
[7] |
Shen J, Chan Y C, Liu S Y. Acta Mater, 2009; 57: 5196
|
[8] |
Ma D, Wang W D, Lahiri S K. J Appl Phys, 2002; 91: 3312
|
[9] |
Chen J, Shen J, Lai S Q, Min D, Wang X C. J Alloys Compd, 2010; 489: 631
|
[10] |
Li J F, Agyakwa P A, Johnson C M. Acta Mater, 2010; 58: 3429
|
[11] |
Kim H K, Liou H K, Tu K N. Appl Phys Lett, 1995; 66: 2337
|
[12] |
Gorlich J, Schmitz G, Tu K N. Appl Phys Lett, 2005; 86: 053106-1
|
[13] |
Shin C K, Baik Y J, Huh J Y. J Electron Mater, 2001; 30: 1323
|
[14] |
Choi S, Lucas J P, Subramanian K N, Bieler T R. J Mater Sci, 2000; 11: 497
|
[15] |
Cho M G, Kim H Y, Seo S K, Lee H M. Appl Phys Lett, 2009; 95: 021905-1
|
[16] |
Gong J C, Liu C Q, Conway P P, Silberschmidt V V. Acta Mater, 2008; 56: 4291
|
[17] |
Chen J K, Beraun J E, Tzou D Y. J Mater Sci, 1999; 34: 6183
|
[18] |
Erickson K L, Hopkins P L, Vianco P T. J Electron Mater, 1998; 27: 117
|
[19] |
Huh J Y, Hong K K, Kim Y B, Kim K T. J Electron Mater, 2004; 33: 1161
|
[20] |
Hong K K, Huh J Y. J Electron Mater, 2006; 35: 56
|
[21] |
Park M S, Arroyave R. Acta Mater, 2010; 58: 4900
|
[22] |
Kim S G, Kim W T, Suzuki T, Ode M. J Cryst Growth, 2004; 261: 135
|
[23] |
Shim J H, Oh C S, Lee B J, Lee D N. Z Metallkd, 1996; 87: 1
|
[24] |
Kim S G, Kim W T, Suzuki T. Phys Rev, 1999; 60E: 7186
|
[25] |
Xu G S,Zeng J B,Zhou M B,Cao S S,Ma X,Zhang X P. In: Bi K Y, Yang D G, Cai M eds., Proceedings of the 12th International Conference on Electronic Packaging Technology & High Density Packaging, Piscataway, NJ: IEEE Press, 2012: 289
|
[26] |
Zhou M B, Ma X, Zhang X P. Acta Metall Sin, 2013; 3: 341
|
[26] |
(周敏波, 马 骁, 张新平. 金属学报, 2013; 3 : 341)
|
[27] |
Ma X, Wang F J, Qian Y Y, Yoshida F. Mater Lett, 2003; 57: 3361
|
[28] |
Yu D Q, Wang L. J Alloys Compd, 2008; 458: 542
|
[29] |
Gosh G. J Appl Phys, 2000; 88: 6887
|
[30] |
Suh J O, Tu K N, Lutsenko G V, Gusal A M. Acta Mater, 2008; 56: 1075
|
[31] |
Gusak A M, Tu K N. Phys Rev, 2002; 66B: 115403-1
|
[32] |
Kim S H, Lee H J, Yu Y S, Won Y S. Acta Mater, 2009; 57: 1254
|
[33] |
Laudise R A, Carruthers J R, Jackson K A. Annu Rev Mater Sci, 1971; 1: 253
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|