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金属学报  2018, Vol. 54 Issue (5): 766-772    DOI: 10.11900/0412.1961.2017.00565
  金属材料的凝固专刊 本期目录 | 过刊浏览 |
坚增运(), 徐涛, 许军锋, 朱满, 常芳娥
西安工业大学陕西省光电功能材料与器件重点实验室 西安 710021
Development of Solid-Liquid Interfacial Energyof Melt-Crystal
Zengyun JIAN(), Tao XU, Junfeng XU, Man ZHU, Fang'e CHANG
Shaanxi Province Key Laboratory of Photoelectric Functional Materials and Devices, Xi'an Technological University, Xi'an 710021, China
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关键词 固-液界面界面能过冷度金属小平面    

Solid-liquid interfacial energy (SLIE) plays a crucial role in accurately evaluating solidification characteristics and effectively tuning the solidification process of crystals, which determines the structures and properties of crystals. This paper is based on the investigations of the authors on SLIE of melt-crystal in the past decade, and concentrates on reviewing the recent developments on the experimental and theoretical results of SLIE of melt-crystal. It draws several important conclusions by comparing various experimental results of SLIE under different temperatures. Firstly, the SLIE of melt-crystal decreases with the decrease of temperature. Secondly, the reason for different SLIE respectively obtained by Spaepen model and experimental measurement is revealed. Eventually, a model and method based on the structure of the solid-liquid interface for predicting the SLIE are proposed, and the results provided by this model are in line with the experimental results and the simulated results at the melting temperature, as well as the experimental results and the simulated results of the undercooled state.

Key wordssolid-liquid interface    interfacial energy    undercooling    metal    facet
收稿日期: 2018-01-02     
ZTFLH:  TG111.4  
基金资助:资助项目 国家自然科学基金项目Nos.51371133和51671151

作者简介 坚增运, 男, 1962年生, 教授, 博士


坚增运, 徐涛, 许军锋, 朱满, 常芳娥. 熔体-结晶相固-液界面能的研究进展[J]. 金属学报, 2018, 54(5): 766-772.
Zengyun JIAN, Tao XU, Junfeng XU, Man ZHU, Fang'e CHANG. Development of Solid-Liquid Interfacial Energyof Melt-Crystal. Acta Metall Sin, 2018, 54(5): 766-772.

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图1  金属Ag、Cu和Ni的均质形核过冷度ΔTV随V/Rc的变化规律[37]
图2  金属Ag、Cu和Ni的固-液界面能与温度之间的关系[37]
Metal σT / (Jm-2) T / K
Ag σT=3.053×10-4T lnT -2.689×10-7T 2+2.501T -1-1.684×10-3T 300~1300
Cu σT=4.357×10-4T lnT -2.644×10-7T 2-2.583×10-3T 500~1400
Ni σT=2.177×10-3T lnT -2.41×10-6T 2+1.245×102T -1+3.634×10-10T 3-1.298×10-2T 700~1400
σT=1.027×10-4T lnT -5.53×10-4T 1400~1728
表1  Ag、Cu和Ni的固-液界面能随温度的变化规律
图3  由ΔT *和ΔT **所预测的Si的固-液界面能与温度间的关系[34]
图4  由ΔT *和ΔT **所预测的初生Si与Si-Al合金熔体在液相线温度下的固-液界面能[35]
图5  由ΔT *和ΔT **所预测的初生Si与Si-Al合金熔体在850 K下的固-液界面能[35]
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