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Effect of Electrolyte Temperature on Microstructures of Direct-Current Electrodeposited Nanotwinned Cu |
Zhao CHENG1,2, Shuai JIN1, Lei LU1( ) |
1 Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China 2 School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China |
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Cite this article:
Zhao CHENG, Shuai JIN, Lei LU. Effect of Electrolyte Temperature on Microstructures of Direct-Current Electrodeposited Nanotwinned Cu. Acta Metall Sin, 2018, 54(3): 428-434.
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Abstract Nanotwinned (NT) metals are promising structural materials due to their excellent combination of strength and ductility. These superior properties are strongly dependent on the microstructures i.e. the twin length (grain size), the twin thickness and the twin orientation. Understanding the synthesis process and growth mechanism of NT metals is essential for their structure design. In this work, the effect of electrolyte temperature on the microstructures of highly oriented NT Cu samples, including twin thickness and twin length (grain size), are systematically studied. The NT Cu samples were prepared by means of the direct-current electrodeposition at 293, 298, 303, 308 and 313 K, respectively, while other deposition parameters such as current density, concentration of additive and pH value were kept constant. With decreasing the temperature from 313 K to 293 K, the average grain size decreases from 27.6 μm to 2.8 μm and the average twin thickness decreases from 111 nm to 28 nm, which results in an increment of hardness from 0.7 GPa to 1.5 GPa. This is because with decreasing the temperature, the overpotential of cathode for depositing metal elevates, leading to the nucleation rate of both the grain and twin enhanced.
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Received: 01 June 2017
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Fund: Supported by National Natural Science Foundation of China (Nos.51420105001, 51371171, 51471172 and 51401211) and Key Research Program of Frontier Sciences, Chinese Academy of Sciences |
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