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| Progress in Fatigue of Small Dimensional Materials |
| ZHANG Guangping; WANG Zhongguang |
| Shenyang National Laboratory for Materials Science; Institute of Metal Research; The Chinese |
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Cite this article:
ZHANG Guangping; WANG Zhongguang. Progress in Fatigue of Small Dimensional Materials. Acta Metall Sin, 2005, 41(1): 1-8 .
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Abstract Small dimensional materials are widely used in micro/nano--systems, such as large
scale integrated circuits and microelectromechanical systems (MEMS).
Since the geometric and microstructural dimensions of the
materials are ranged from microns to nanometers,
the constraints of the dimensions on dislocation activities and the effects of
surfaces and interfaces in the small dimensional materials result in fatigue behaviors different
from that of the bulk materials. In this paper, fatigue testing methods,
cyclic deformation, crack initiation and propagation behaviors of the small dimensional materials studied in recent years, such as thin films, are reviewed. The corresponding fatigue size effects and damage mechanisms are discussed. The prospective research directions of fatigue of small dimensional materials in the future are forecasted.
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Received: 20 July 2004
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[1] Menz W, Mohr J, Paul O. Microsystem Technology. Wein-heim: WILEY-VCH, 2001: 1
[2] Spearing S M. Acta Mater, 2000; 48: 179
[3] Ohring M. Reliability and Failure of Electronic Materialsand Devices. Academic Press, 1998: 4
[4] Nix W D. Metall Trans, 1989; 20A: 2217
[5] Arzt E. Acta Mater, 1998; 46: 5611
[6] Keller R M, Baker S P, Arzt E. J Mater Res, 1998; 13:1307
[7] Hommel M, Kraft O. Acta Mater, 2001; 49: 3935
[8]Suresh S,Translated by Wang Z G.Fatigue of Materials. Beijing:National Defense Industry Press,1999:37 (Suresh S著,王中光译.材料的疲劳(第二版).北京:国防 工业出版社,1999:37)
[9] Grosskreutz J C, Mughrabi H. In: Argon A S ed, Constitutive Equations in Plasticity Cambridge, MA: The MIT Press, 1975: 251
[10] Sharpe Jr W N, Yuan B, Edwards R L. J Microelec-tromechan Syst, 1997; 6: 193
[11] Tsuchiya T, Tabata O, Sakata J, Taga Y. In: Proceedings of IEEE Tenth Annual International Workshop on Micro Electro Mechanical Systems. 1997: 529
[12] Kapels H, Aigner R, Binder J. IEEE Trans Electron Devices, 2000; 47: 1522
[13] Judelewicz M. Scr Metall Mater, 1993; 29: 1463
[14] Hommel M, Kraft O, Arzt E. J Mater Res, 1999; 14: 2373
[15] Brown S B, van Arsdell W, Muhlstein C L. In: Transducers-97: Int Conf on Solid State Sensors and Actuators, Chicage, Illinois: Digest of Technical Papers, 1997: 591
[16] Kahn H, Ballarini R, Mullen R L, Heuer A H. Proc RoyalSoc London, 1999; 455: 3807
[17] Schwaiger R, Kraft O. Scr Mater, 1999; 41: 823
[18] Takashima K, Maekawa S, Shimojo M, Higo Y, SugiuraS, Pfister B, Swain M V. In: Wu X R, Wang Z G eds,Proceedings of the 7th International Fatigue Congress,Cradley Heath, UK: High Education Press, 1999; 3: 1871
[19] Zhang G P, Takashima K, Shimojo M, Higo Y. Mater Lett,2003; 57(1): 1555
[20] Connally J A, Brown S B. Exp Mechan, 1992; 32: 81
[21] Muhlstein C L, Stach E A, Ritchie R O. Appl Phy Lett,2002; 80: 1532
[22] Muhlstein C L, Brown H B, Ritchie R O. Sens Actuators,2001; 94: 177
[23] Allameh S M, Gaily B, Brown S, Soboyejo W O. ASTMSTP 1413, West Conshohocken, 2000
[24] Hofbeck R, Hausmann K, Ilschner B, Kuenzi H U. ScrMetall, 1986; 20: 1601
[25] Judelewicz M, Kunzi H U, Merk N, Ilschner B. Mater SciEng, 1994; A186: 135
[26] Hong S, Weil R. Thin Solid Films, 1996; 283: 175
[27] Read D T. Int J Fatigue, 1998; 20: 203
[28] Merchant H D, Minor M G, Liu Y L. J Electron Mater,1999; 28: 998
[29] Hadrboletz A, Kathibi G, Weiss B, Stickler R. In: Wu XR, Wang Z G eds, Proceedings of the 7th InternationalFatigue Congress, Cradley Heath, UK: High EducationPress, 1999: 1865
[30] Schwaiger R, Dehm G, Kraft O. Philos Mag, 2003; 83: 693
[31] Kraft O, Schwaiger R, Wellner P. Mater Sci Eng, 2001; A319-321: 919
[32] Kraft O, Wellner P, Hommel M, Schwaiger R, Arzt E. ZMetallkd, 2002; 93(5): 392
[33] Schwaiger R, Kraft O. Acta Mater, 2003; 51(1): 195
[34] Zhang G P, Schwaiger R, Volkert C A, Kraft O. PhilosMag Lett, 2003; 83: 477
[35] Maekawa S, Takashima K, Shimojo M, Higo Y. Jpn J ApplPhys, 1999; 38: 7194
[36] Takashima K, Higo Y, Sugiura S, Shimojo M. MaterTrans, 2001; 42: 68
[37] Zhang G P, Volkert C A, Schwaiger R, Arzt E, Kraft O.Accepted by J Mater Res, 2005; 20(1): 201
[38] Zhang G P, Takashima K, Higo Y. Acta Metall Sin , inpress(张广平,高岛和希,肥後失吉.金属学报,待发表)
[39] Mughrabi M, Wang R, Differt K, Essmann U. ASTM STP811, 1983: 5
[40] Zhang G P, Volkert C A, Schwaiger R, Wellner P, Arzt E,Kraft O. to be published
[41] Freund L B. J Appl Mech, 1987; 54: 553
[42] Thiele E, Holste C, Klemm R. Z Metallkd, 2002; 93: 730
[43] Tang M J, Xu J S, Cai W, Bulatov V. Mater Res SocSymp Proc, 2003; 795: U2.4.1
[44] Gao H, Huang Y, Nix W D, Hutchinson J W. J Mech PhysSolids, 2000; 48: 99.
[45] Hwang K C, Jiang H, Huang Y, Gao H, Hu N. J MechPhys Solids, 2002; 50: 81.
[46] Chen S H, Wang Z Q. Adv Mech, 2003; 33: 407(陈少华,王自强.力学进展, 2003;33:407)
[47] Stoken J S, Evans A G. Acta Mater, 1998; 46: 5109
[48] Liu Y, Ngan A H W. Scr Mater, 2001; 44: 237
[49] Ashby M F. Philos Mag, 1970; 21: 399
[50] Zhang G P, Moenig R, Park Y B, Arzt E, Volkert C A. tobe published, 2005 |
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