STUDY ON THE MICROSTRUCTURE EVOLUTION OF Cu-Nb COMPOSITE WIRES DURING DEFORMATION AND ANNEALING

doi:10.3724/SP.J.1037.2013.00622

Acta Metall Sin

2014, Vol. 50

Issue (2): 231-237 DOI: 10.3724/SP.J.1037.2013.00622

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STUDY ON THE MICROSTRUCTURE EVOLUTION OF Cu-Nb COMPOSITE WIRES DURING DEFORMATION AND ANNEALING

DENG Liping^1,², YANG Xiaofang¹, HAN Ke², SUN Zeyuan¹, LIU Qing¹(

)

1 School of Materials Science and Engineering, Chongqing University, Chongqing 400044
2 National High Magnetic Field Laboratory, Tallahassee, Florida, USA, 32310

Cite this article:

DENG Liping, YANG Xiaofang, HAN Ke, SUN Zeyuan, LIU Qing. STUDY ON THE MICROSTRUCTURE EVOLUTION OF Cu-Nb COMPOSITE WIRES DURING DEFORMATION AND ANNEALING. Acta Metall Sin, 2014, 50(2): 231-237.

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Abstract

Microstructure of as-deformed and annealed Cu-Nb composite wires were investigated by SEM and TEM. Hardness of the as-deformed and annealed samples were measured. The results showed that both the interface density and the rate of interface-increasing increased with increasing strain. When the microstructure reached nano-scale (strain=24.8), the interface density showed a sharp increase which induced a rapid increase in hardness, accompanied by formation of stacking faults and rotation grain boundaries in Cu. During the annealing, the size effect impacted the evolution of microstructure of the multi-scale Cu matrix. The evolution can be classified in to three stages with respect to annealing temperatures: recovery and recrystallization of large Cu, while that of the nano Cu were restrained; recovery and recrystallization of nano Cu; spheroidization and coarsening of Nb.

Key words: Cu-Nb composite wire interface density stacking fault size effect

Received: 30 September 2013

ZTFLH:

TG146.1

Fund: Supported by National Natural Science Foundation of China (Nos.51031002 and 51201188), Danish National Research Foundation and National Natural Science Foundation of China (No. NSFC-DNRF 51261130091), Natural Science Foundation Project of Chongqing Science and Technology Commission (No.2010BB4074), State Key Laboratory For Advanced Metals and Materials (No.2010ZD-02) and National Science Foundation of United States (No.DMR-0084173)

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	Liping DENG
	Xiaofang YANG
	Ke HAN
	Zeyuan SUN
	Qing LIU

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https://www.ams.org.cn/EN/10.3724/SP.J.1037.2013.00622 OR https://www.ams.org.cn/EN/Y2014/V50/I2/231

Fig.1

不同应变量下Cu-Nb复合线材试样横截面微观组织SEM像

表1 不同应变量下Cu-Nb复合线材中Nb丝尺寸(d)和间距(t)

Fig.2

不同应变量下的硬度及界面密度的变化

Fig.3

应变ε=24.8时试样的TEM像

Fig.4

应变为24.8的试样纵截面的高分辨率透射电镜图

Fig.5

应变为24.8的试样在不同温度退火后的TEM像

Fig.6

应变为24.8试样的硬度随退火温度的变化

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