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Progress in Thermal Fatigue of Micro/Nano-ScaleMetal Conductors |
Guangping ZHANG1(), Honglei CHEN1,2, Xuemei LUO1, Bin ZHANG3 |
1 Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China 2 School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China 3 Key Laboratory for Anisotropy and Texture of Materials, Ministry of Education, School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China |
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Cite this article:
Guangping ZHANG, Honglei CHEN, Xuemei LUO, Bin ZHANG. Progress in Thermal Fatigue of Micro/Nano-ScaleMetal Conductors. Acta Metall Sin, 2018, 54(3): 357-366.
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Abstract The world has gradually entered the industrial 4.0 Era, which is dominated by the Internet of Things (IOT) and intelligent manufacturing. Especially, strong requirement for artificial intelligence and big data processing, the development and preparation of micro/nano electronic devices is becoming increasingly active, and much more concerns have been attracted to small-scale materials. Because of the constraint effect of geometric and microstructural dimensions of these materials, the thermal fatigue damage behavior is different from that of the bulk counterparts. At the same time, the change of the material scale from microns to nanometers also results in the transformation of the deformation mechanism, so that the materials exhibit different damage behaviors and significant size effects. In this paper, thermal fatigue testing methods, thermal fatigue damage and evolution, and the factors influencing thermal fatigue properties of metal film/line are reviewed, the corresponding mechanism of thermal fatigue and the size effect of the micro/nano-scale metals are discussed. The prospective research of this field in the future is addressed.
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Received: 05 September 2017
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Fund: Supported by National Natural Science Foundation of China (Nos.51371047, 51671050 and 51601198) |
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