Acta Metall Sin  1996, Vol. 32 Issue (3): 308-312    DOI:

Current Issue | Archive | Adv Search |

IN SITU MEASUREMENT OF ELECTRIC CONDUCTIVITY OF ULTRA THIN Al FILM

TANG Zhaolin; HUANG Rongfang; WEN Lishi(Institute of Metal Research;Chinese Academy of Sciences; Shenyang 110015) (Manuscript received 1995-05-04; in revised form 1995-08- 15)

TANG Zhaolin; HUANG Rongfang; WEN Lishi(Institute of Metal Research;Chinese Academy of Sciences; Shenyang 110015) (Manuscript received 1995-05-04; in revised form 1995-08- 15). IN SITU MEASUREMENT OF ELECTRIC CONDUCTIVITY OF ULTRA THIN Al FILM. Acta Metall Sin, 1996, 32(3): 308-312.

Abstract References Related Articles Recommended Metrics Download:  PDF(350KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The electric conductivity of sputtered ultrathin Al films as a function of thickness has been measured in situ during vacuum deposition process. At different stages of growth, the films have the different electric conductivity characteristics. Therotical analysis showed that surface scattering and grain boundary scattering played a main role in size effect of resistivity. Correspondent: TANG Zhaolin, Institute of Corrosion and Protection of Metals, Chinese Academy of Scicnces,Shenyang 110015 Key words:  ultrathin film      electric conductivity      size effect      Received:  18 March 1996      Service E-mail this article Add to citation manager E-mail Alert RSS Collect articles（0） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1996/V32/I3/308 1SondheimerEH．AdvPhys,1952;1:12MayadasAF,ShatzkesM．PhysRev,1970;B1:13823TesanovicZ,JaricMV,MackawaS．PhyRevLett,1986;57:27684TrivediN,AshcronftNW．PhysRev,1988;B38:2985FichmanG,ColeckiD．PhysRevLett,1989;62:13026ShenggL,ShengL,XingDY,WangZD．PhysRev,1995;B51:73257KadereitHG．ThinSolidFilm,1971;1:1098FridrichJ．ThinSoidFilm,1971;7:2179MinnSS,RechJ．CentrNatlResSciLab,(BellevueParis)1960:5110VansteenselK．PhillipsResRep,1967;22:24611NeugebauerA,WebbMB．JApplPhys,1962;33:7412ShengP,AbelesB,ArieY．PhysReyLett,1973:31:4413ShengP．PhilosMag,1992:B65:35714HolwechI,JeppesenJ．PhilosMag,1967;15:21715WenLS,HuangRF,GuoLP,WeiTY,ChuangYZ．JMagnMagnMater1993;126:200 [1] ZHAO Yafeng, LIU Sujie, CHEN Yun, MA Hui, MA Guangcai, GUO Yi. Critical Inclusion Size and Void Growth in Dual-Phase Ferrite-Bainite Steel During Ductile Fracture[J]. 金属学报, 2023, 59(5): 611-622. [2] YU Shaoxia, WANG Qi, DENG Xiangtao, WANG Zhaodong. Preparation and Size Effect of GH3600 Nickel-Based Superalloy Ultra-Thin Strips[J]. 金属学报, 2023, 59(10): 1365-1375. [3] QU Ruitao, WANG Xiaodi, WU Shaojie, ZHANG Zhefeng. Research Progress in Shear Banding Deformation and Fracture Mechanisms of Metallic Glasses[J]. 金属学报, 2021, 57(4): 453-472. [4] CAO Qingping, LV Linbo, WANG Xiaodong, JIANG Jianzhong. Magnetron Sputtering Metal Glass Film Preparation and the “Specimen Size Effect” of the Mechanical Property[J]. 金属学报, 2021, 57(4): 473-490. [5] Guangping ZHANG, Honglei CHEN, Xuemei LUO, Bin ZHANG. Progress in Thermal Fatigue of Micro/Nano-ScaleMetal Conductors[J]. 金属学报, 2018, 54(3): 357-366. [6] Yefei MA, Zhuman SONG, Siqian ZHANG, Lijia CHEN, Guangping ZHANG. Evaluation of Fatigue Properties of CA6NM Martensite Stainless Steel Using Miniature Specimens[J]. 金属学报, 2018, 54(10): 1359-1367. [7] Rui YANG,Yan PAN,Wei CHEN,Qiaoyan SUN,Lin XIAO,Jun SUN. DEFORMATION BEHAVIOR AND THE MECHANISM OF MICRO-SCALE Ti-10V-2Fe-3Al PILLARSIN COMPRESSION[J]. 金属学报, 2016, 52(2): 135-142. [8] Jun SUN, Jinyu ZHANG, Kai WU, Gang LIU. SIZE EFFECTS ON THE DEFORMATION AND DAMAGEOF Cu-BASED METALLIC NANOLAYEREDMICRO-PILLARS[J]. 金属学报, 2016, 52(10): 1249-1258. [9] HUANG Xiaoxu. SIZE EFFECTS ON THE STRENGTH OF METALS[J]. 金属学报, 2014, 50(2): 137-140. [10] ZHANG Jinyu, LIU Gang, SUN Jun. SIZE EFFECTS ON DEFORMATION AND FRACTURE BEHAVIOR OF NANOSTRUCTURED METALLIC MULTILAYERS[J]. 金属学报, 2014, 50(2): 169-182. [11] DENG Liping, YANG Xiaofang, HAN Ke, SUN Zeyuan, LIU Qing. STUDY ON THE MICROSTRUCTURE EVOLUTION OF Cu-Nb COMPOSITE WIRES DURING DEFORMATION AND ANNEALING[J]. 金属学报, 2014, 50(2): 231-237. [12] ZHANG Jinyu ZHANG Xin NIU Jiajia LIU Gang ZHANG Guojun SUN Jun. LENGTH SCALE DEPENDENT MECHANICAL/ELECTRICAL PROPERTIES OF Cu/X (X=Cr, Nb) NANOSTRUCTURED METALLIC MULTILAYERS[J]. 金属学报, 2011, 47(10): 1348-1354. [13] YIN Limeng YANG Yan LIU Liangqi ZHANG Xinping. SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING[J]. 金属学报, 2009, 45(4): 422-427. [14] terry liau; Hao Du; Li-shi WEN. The influence of size effect of conductivity on the microwave absorption properties of thin Al films[J]. 金属学报, 2008, 44(9): 1099-1104 . [15] Mingxia Liu; Yongfeng Hu; FEI MA; Kewei XU. COHERENT GROWTH OF α-W FILM ON Si WAFER AND ITS THICKNESS DEPENDENT MECHANICAL AND ELECTRICAL PROPERTIES[J]. 金属学报, 2008, 44(5): 631-635 . No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed