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INFLUENCE OF INDENTATION DEPTH AND FILM THICKNESS ON COMPOSITE HARDNESS AND MODULUS OF COATING-SUBSTRATE SYSTEMS |
XU Kewei; HOU Genliang; YU Guang (State Key Laboratory for Mechanical Behaviour of Materials; Xi′an Jiaotong University; Xi′an 710049)CHEN Guoliang.LIU Danmei (State Key Laboratory for New Metallic Materials; University of Science and Technology Beijing; Beijing 100083)(Manuscript received 1995-05-12; in revised form; 1995-09-15) |
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Cite this article:
XU Kewei; HOU Genliang; YU Guang (State Key Laboratory for Mechanical Behaviour of Materials; Xi′an Jiaotong University; Xi′an 710049)CHEN Guoliang.LIU Danmei (State Key Laboratory for New Metallic Materials; University of Science and Technology Beijing; Beijing 100083)(Manuscript received 1995-05-12; in revised form; 1995-09-15). INFLUENCE OF INDENTATION DEPTH AND FILM THICKNESS ON COMPOSITE HARDNESS AND MODULUS OF COATING-SUBSTRATE SYSTEMS. Acta Metall Sin, 1996, 32(1): 23-28.
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Abstract 篈 method using one load-displacement curve to calculate composite hardness distribution of coating-substrate system was proposed and varified on Nano-Ⅱ indenter. To take into account the variation of composite elastic modulus through the indentation depth and its effect on hardness measurement, the Gao′s model was introduced in the present method. The results of electroless Ni-P coatings with different thicknesses indicated that the composite hardness calculated by the proposed method agrees basically with experimental data. It appeared to be most important that the true hardness of coatings can be predicted provided that several composite hardnesses have been obtained experimentally. Correspondent: XU Kewei, professor,(School of Materials Science and Engineering, Xi′an Jiaotong University, Xi′an 710049)
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Received: 18 January 1996
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1闻立时,黄荣芳.见:中国材料研究学会编,92′秋季中国材料研讨会论文集,广州,1992:1092BhttacharyaAK,NixWD.IntJSolidStruct.1988;24:12873KingRB.IntJSolidStruct,1987;23:16574GaoHJ,ChiuCH,LeeJ.IntJSolidStruct,1992;29:24715BurnettPJ,RickerbyDS.ThinSolidFilms,1987;148:416侯根良,刘军海,徐可为.金属学报,1995;31:A2367HendrixBC,刘军海,何家文.见:中国电子学会编,第五届全国固体薄膜研讨会论文集,北京,1994:2038NixWD.MetallTrans,1989;20A:22179蔡洵,张兮,周平南.理化检验-物理分册,1993;29(4):1910FleckNA,MullerGW,AshbyMF,HutchinsonJW.ActaMetallMater,1994;42:47511OliverWC,PharrGM.JMaterRes,1992;7(6):1564 |
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