Stress Relaxation and Elastic Recovery of Monocrystalline Cu Under Water Environment

doi:10.11900/0412.1961.2019.00041

Acta Metall Sin

2019, Vol. 55

Issue (8): 1034-1040 DOI: 10.11900/0412.1961.2019.00041

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Stress Relaxation and Elastic Recovery of Monocrystalline Cu Under Water Environment

Junqin SHI¹,Kun SUN²,Liang FANG²,Shaofeng XU³(

)

1. Xi’an Rare Metal Materials Institute Co. , Ltd. , Xi’an 710016, China
2. State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
3. Ningbo Institute of Technology, Zhejiang University, Ningbo 315000, China

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Junqin SHI,Kun SUN,Liang FANG,Shaofeng XU. Stress Relaxation and Elastic Recovery of Monocrystalline Cu Under Water Environment. Acta Metall Sin, 2019, 55(8): 1034-1040.

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Abstract

The stress relaxation and elastic recovery have an important effect on the mechanical and electrical properties of metallic crystal materials, which restricts the range of application and working life of materials. However, during plastic deformation of materials, the relaxation and elastic recovery behaviors are still not very clear at the nanoscale. In this work, the stress relaxation and elastic recovery of monocrystalline Cu under water environment is studied by molecular dynamics simulation. The results indicate the stress acting on Cu surface decreases at constant strain, meaning the occurrence of stress relaxation phenomenon. The stress relaxation increases with water film thickening compared with no-water environment. The separation between Cu atoms dramatically decreases with the increasing indentation depth at indenting stage, and there is no clear change in the nearest interatomic separation at stress relaxation stage, but the separation increases rapidly due to the release of elastic energy and dislocation energy at the unloading stage. The nucleated dislocations within Cu coated by water film are obviously more than that without water, which suggests the water film increases the unrecovered deformation in the total nanoindentation process. During unloading, partial dislocations disappear because of the deformation energy release, while the water film impedes the elastic recovery and plastic release.

Key words: stress relaxation elastic recovery monocrystalline Cu molecular dynamics

Received: 20 February 2019

ZTFLH:

TG14

Fund: Young Scientists Fund of National Natural Science Foundation of China((No.51605432));Young Scientists Fund of the Natural Science Foundation of Zhejiang Province, China((No.LQ16E050007));Natural Science Foundation of Ningbo, China((No.2015A610097))

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	Junqin SHI
	Kun SUN
	Liang FANG
	Shaofeng XU

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https://www.ams.org.cn/EN/10.11900/0412.1961.2019.00041 OR https://www.ams.org.cn/EN/Y2019/V55/I8/1034

Fig.1 The initial model of nanoindentation of monocrystalline copper under water environmentColor online

Table 1 Parameters for TIP4P and Lennard-Jones potential^[30,31,32]

Fig.2 Schematic of displacement-controlled nano-indentation

Fig.3 Load-indentation depth curves of without (a), and with H=1.0 nm (b), 2.0 nm (c) and 3.0 nm (d) water films (H—water film thickness)

Fig.4 The nearest interatomic separation among Cu atoms in indenting region under different water environments

Fig.5 The slice configurations of monocrystalline copper before (orange) and after (blue) unloading of without (a), and with H=1.0 nm (b), 2.0 nm (c) and 3.0 nm (d) water filmsColor online

Fig.6 Default configurations within monocrystalline copper after loading (left), after stress relaxation (middle), and after unloading (right) of without (a), and with H=1.0 nm (b), 2.0 nm (c) and 3.0 nm (d) water films (blue—undeformed atom, red—surface and partial dislocation atom, green—stacking fault atom)Color online

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