EFFECT OF ELECTRON BEAM POWER ON TC4 ALLOY RIGID RESTRAINT THERMAL SELF-COMPRESSING BONDING, MICRO- STRUCTURE AND MECHANICAL PROPERTIES OF JOINTS

doi:10.11900/0412.1961.2015.00105

Acta Metall Sin

2015, Vol. 51

Issue (9): 1111-1120 DOI: 10.11900/0412.1961.2015.00105

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EFFECT OF ELECTRON BEAM POWER ON TC4 ALLOY RIGID RESTRAINT THERMAL SELF-COMPRESSING BONDING, MICRO- STRUCTURE AND MECHANICAL PROPERTIES OF JOINTS

Yunhua DENG^1,²,Qiao GUAN^1,²(

),Jun TAO²,Bing WU²,Xichang WANG²

1 School of Mechanical Engineering and Automation, Beihang University, Beijing 100191
2 Beijing Aeronautical Manufacturing Technology Research Institute, Beijing 100024

Cite this article:

Yunhua DENG,Qiao GUAN,Jun TAO,Bing WU,Xichang WANG. EFFECT OF ELECTRON BEAM POWER ON TC4 ALLOY RIGID RESTRAINT THERMAL SELF-COMPRESSING BONDING, MICRO- STRUCTURE AND MECHANICAL PROPERTIES OF JOINTS. Acta Metall Sin, 2015, 51(9): 1111-1120.

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Abstract

Rigid restraint thermal self-compressing bonding is a new solid-state bonding process. During the process, localized non-melted heating method is employed to heat the butted interface of the rigid restrained plates to be bonded. Under the localized heating, materials close to the butted interface are expanded. However, due to the existence of surrounding cool metals and rigid restraints, the expansion of the high temperature materials is restrained and thus, a compressive pressure is developed which compresses the high temperature metals near the bond interface and facilitates the atom diffusion between butt-weld specimens to produce a permanent solid-state joint. Utilizing the localized stress-strain field to accomplish atomic bonding, this process can avoid the use of external forces on which diffusion bonding and other solid-state bonding methods rely. Previous study has proven the feasibility of this process to join titanium alloys. In present work, the effect of beam power on bond interface, microstructure and mechanical properties of the TC4 joints bonded at different beam powers were analyzed through the OM observation, EBSD analysis, mechanical property test and fracture morphology analysis. Meanwhile, in order to reveal the mechanism about the effect of beam power on bond interface, the experiment study on microstructure and mechanical property and finite element analysis on present bonding were conducted to investigate the effect of beam power on the thermal stress-strain process during bonding. The results show that with the increase of beam power, the heating temperature, dwell time over high temperature, volume of materials with high temperature and the compressive plastic strain increase which promote the atom diffusion and thus bond quality of the interface is improved. At low beam power, the microstructure of the joints is homogeneous, while coarse grain with acicular a phase forms in the joint when the beam power is high. Mechanical properties of the joint are dependent on bond rate and microstructure. When the beam power is lower or higher, the compressive mechanical properties of the joints are poor because of the poor bonding quality of the interface or the coarse microstructure developed in the joint. Good comprehensive mechanical properties are obtained at the beam power of 330 W.

Key words: thermal self-compressing bonding thermal stress-strain process beam power microstructure mechanical property

Fund: Supported by National Natural Science Foundation of China (No.50935008)

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	Yunhua DENG
	Qiao GUAN
	Jun TAO
	Bing WU
	Xichang WANG

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https://www.ams.org.cn/EN/10.11900/0412.1961.2015.00105 OR https://www.ams.org.cn/EN/Y2015/V51/I9/1111

Fig.1 Schematic of rigid restraint thermal self-compressing for TC4 alloy (F—thermal compressive pressure)

Table 1 Parameters of rigid restraint thermal self-compressing bonding

Fig.2 Schematic of dimensions of tensile specimen (unit: mm)

Fig.3 Bond interfaces of TC4 alloy joints by rigid restraint thermal self-compressing bonding at beam powers of 270 W (a), 330 W (b) and 780 W (c)

Fig.4 Microstructure of TC4 alloy base metal

Fig.5 Grain orientation maps of TC4 alloy base metal (a) and joints at beam powers of 330 W (b) and 780 W (c) (Insets show the corresponding pole figures)

Fig.6 Misorientation angle distributions of a phase in TC4 alloy base metal (a) and the joints at beam powers of 330 W (b) and 780 W (c)

Fig.7 Fracture locations (insets) and morphologies of TC4 alloy joints at beam powers of 270 W (a), 330 W (b) and 780 W (c)

Table 2 Mechanical properties of TC4 alloy base metal and joints bonded at different beam powers

Fig.8 Mesh generation near the bond interface (P1—central point of bond line on top surface, P2—middle point of bond interface, P3—central point of bond line on low surface)

Fig.9 Illustration of elongated Gaussian surface heat source (l—length of elongated Gaussian surface heat source)

Fig.10 Comparison between numerical and experimental results of thermal cycles (a) and residual stress distributions (b) (s_x—longitudinal residual stress along x direction, s_y—transversal residual stress along y direction)

Fig.11 Thermal cycles of points P1 (a), P2 (b) and P3 (c) shown in Fig.8 during TC4 alloy bonding at different beam powers

Fig.12 Temperature distributions on middle cross-section of TC4 alloy during bonding at different beam powers

Fig.13 Transversal stress and strain evolutions of middle point of bond interface (P2) during bonding at beam powers of 270 W (a), 330 W (b) and 780 W (c) for TC4 alloy

Fig.14 Temperature distributions of different beam powers at heating time about 10 s for TC4 alloy

Fig.15 Temperature distributions when the compressive stresses reaching the peak values at different beam powers (t—time)

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