形变及热处理对825合金管材晶界特征分布的影响<sup>*</sup>

doi:10.11900/0412.1961.2015.00124

金属学报

2015, Vol. 51

Issue (12): 1465-1471 DOI: 10.11900/0412.1961.2015.00124

本期目录 | 过刊浏览

形变及热处理对825合金管材晶界特征分布的影响^*

赵清¹,夏爽¹(

),周邦新¹,白琴¹,苏诚²,王宝顺²,蔡志刚²

1 上海大学材料科学与工程学院, 上海 200072
2 浙江久立特材科技股份有限公司, 湖州 313008

EFFECT OF DEFORMATION AND THERMOMECHA- NICAL PROCESSING ON GRAIN BOUNDARY CHARACTER DISTRIBUTION OF ALLOY 825 TUBES

Qing ZHAO¹,Shuang XIA¹(

),Bangxin ZHOU¹,Qin BAI¹,Cheng SU²,Baoshun WANG²,Zhigang CAI²

1 School of Materials Science and Engineering, Shanghai University, Shanghai 200072
2 Zhejiang Jiuli Hi-Tech Metals Co. Ltd., Huzhou 313008

引用本文:

赵清,夏爽,周邦新,白琴,苏诚,王宝顺,蔡志刚. 形变及热处理对825合金管材晶界特征分布的影响^*[J]. 金属学报, 2015, 51(12): 1465-1471.
Qing ZHAO, Shuang XIA, Bangxin ZHOU, Qin BAI, Cheng SU, Baoshun WANG, Zhigang CAI. EFFECT OF DEFORMATION AND THERMOMECHA- NICAL PROCESSING ON GRAIN BOUNDARY CHARACTER DISTRIBUTION OF ALLOY 825 TUBES[J]. Acta Metall Sin, 2015, 51(12): 1465-1471.

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摘要:

采用工厂生产线上的冷拔机对镍基825合金管材进行冷拔加工后再退火, 进行晶界工程(GBE)处理. 利用EBSD和取向成像显微技术(OIM)研究了不同冷拔变形量和不同退火温度对825合金晶界特征分布(GBCD)的影响. 结果表明, 合金在冷拔变形5%, 1050 ℃退火10 min时, 低Σ值重合位置点阵(ΣCSL, coincidence site lattice, Σ≤29)晶界的比例可提高到75%以上(Palumbo-Aust标准), 同时形成大尺寸的“互有Σ3ⁿ取向关系晶粒的团簇”显微组织(n=1, 2, 3, ...). 随着再结晶退火前冷拔变形量的增加, 晶粒团簇的尺寸减小, 同时低ΣCSL晶界的比例也下降, 并且低ΣCSL晶界的比例随晶粒尺寸的增加而下降. 当合金经过5%的冷拔变形后, 在1050~1125 ℃退火处理10 min时的晶界特征分布无明显变化, 退火温度对合金的低ΣCSL晶界比例影响较小; 当经过3%, 7%和10%的冷拔变形后, 合金的低ΣCSL晶界比例随着退火温度的升高不断下降.

关键词 ：镍基825合金,, 晶界特征分布,, 低ΣCSL晶界,, 晶粒尺寸

Abstract：

Alloy 825 is widely used for chemical and petrochemical applications due to its good combination of mechanical properties and corrosion resistance. However, intergranular corrosion (IGC) is one of the serious problems for alloy 825 exposed to aggressive environments, which could result in unexpected failures and lead to huge losses. The grain boundary structure, which can partly be described by coincidence site lattice (CSL) model, can influence the grain boundary chemistry and the susceptibility to intergranular corrosion. The field of grain boundary engineering (GBE) has developed a lot over the last two decades since the concept of grain boundary design was proposed. The aim of GBE is to enhance the grain-boundary-related properties of materials by increasing the frequency of low ΣCSL (Σ≤29) grain boundaries (GBs) and tailoring the grain boundary network. It was reported that in some fcc materials with low stacking fault energy, such as Ni-based alloys, lead alloys, austenitic stainless steels and copper alloys, the frequency of low ΣCSL GBs can be greatly increased by using proper thermomechanical processing (TMP), and as a result the grain boundary related properties were greatly enhanced. In this work, GBE is applied to the manufacture of Ni-based alloy 825 tubes by cold drawing using a draw-bench on a factory production line and the subsequent annealing. The effect of thermomechanical processing on the grain boundary character distribution (GBCD) of alloy 825 was studied by means of the EBSD technique and orientation image microcopy (OIM). The results show that the proportion of low ΣCSL grain boundaries increase to more than 75% by the TMP after 5% cold drawing and subsequent annealing at 1050 ℃ for 10 min, and simultaneously the large-size highly-twinned grain-cluster microstructure is formed. The size of the grain-cluster and proportion of low ΣCSL grain boundaries decrease with the increase of pre-strain. The proportion of low ΣCSL grain boundaries decreases with the increase of the mean grain size. The annealing temperatures in the range of 1050~1125 ℃ have no obvious effect on the GBCD of the specimen with 5% cold drawing deformation; while the proportions of low ΣCSL GBs of the sample with 3%, 7% and 10% cold drawing deformation decrease with the increase of annealing temperature.

Key words： Ni-based alloy 825 grain boundary character distribution low ΣCSL grain boundary grain size

基金资助:* 国家重点基础研究发展计划项目2011CB610502 和上海市科委重点支撑项目13520500500 资助

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https://www.ams.org.cn/CN/10.11900/0412.1961.2015.00124 或 https://www.ams.org.cn/CN/Y2015/V51/I12/1465

图1 固溶态825合金管材的OM像、晶界分布图和晶粒取向分布图

图2 冷拔变形量及退火温度对825合金晶界特征分布的影响

图3 经不同冷拔变形量和退火温度处理后(Σ9+Σ27)/Σ3晶界比值

图4 经不同冷拔变形量及退火温度处理后的不同类型晶界图

图5 图4a中晶粒团簇C1的不同类型晶界图和晶粒取向分布图

图6 冷拔变形量对1050 ℃再结晶退火后825合金晶粒团簇尺寸的影响

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