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金属学报  2013, Vol. 49 Issue (2): 207-213    DOI: 10.3724/SP.J.1037.2012.00357
  论文 本期目录 | 过刊浏览 |
HCO3-, SO42-和Cl-混合体系中Cu点蚀行为的研究
王长罡,董俊华,柯伟,李晓芳
中国科学院金属研究所金属腐蚀与防护国家重点实验室, 沈阳 110016
INVESTIGATION ON PITTING CORROSION BEHAVIOR OF COPPER IN THE MIXED SOLUTION OF HCO3-, SO42- AND Cl-
WANG Changgang, DONG Junhua, KE Wei, LI Xiaofang
State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016
全文: PDF(1470 KB)  
摘要: 

HCO3-浓度为0.08 mol/L及不同浓度配比的SO42-和Cl-混合溶液中, 利用循环极化电化学测试方法和SEM, 对Cu工作电极的循环极化行为和点蚀表面形貌进行了系统的研究. 结果表明, SO42-或Cl-均能促进Cu的阳极溶解, 且二者间存在交互作用. Cl-能降低Cu电极的腐蚀电位, 增强其电化学活性. 在点蚀敏感区域图中, Cu发生点蚀的临界Cl-浓度为0.02 mol/L. 当Cl-浓度较低时, SO42-对点蚀敏感性无影响; 当Cl-浓度为中等时, SO42-抑制点蚀; 当Cl-浓度较高时, SO42-使Cu点蚀敏感性先升高后降低. 无论SO42-浓度的高低, Cl-都能促进点蚀. 在本研究体系中, Cu的点蚀敏感性强烈地受到Cl-和SO42-的影响.

关键词 高放废物地质处置Cu点蚀, HCO3- SO42-Cl-    
Abstract

In this work, the pitting corrosion behavior of Cu in the mixed solution of HCO3-, Cl- and SO42- simulating groundwater was investigated by means of cyclic polarization test and SEM microscopy. The results showed that both SO42- and Cl- can synergistically promote the anodic dissolution of Cu electrode. Cl- can decrease the corrosion potential of Cu to enhance its electrochemical activity. The plot of pitting sensitivity of Cu showed that the pitting critical concentration of Cl- was 0.02 mol/L. When the concentration of Cl- was low, SO42- did not affect the pitting susceptibility; when the concentration of Cl- was in the middle, SO42- strongly inhibited the pitting corrosion of Cu; when the concentration of Cl- was high, the pitting susceptibility will first increase and then reduce with increasing the concentration of SO42-. Regardless of what concentration of SO42-, Cl- can promote the pitting corrosion of Cu. In the current solution system, it is found that the pitting corrosion of Cu was sorely sensitive to SO42- and Cl-.

Key wordshigh-level radioactive waste    copper    pitting    HCO3-, SO42-    Cl-
收稿日期: 2012-06-15     
基金资助:

国家自然科学基金资助项目51071160

通讯作者: 董俊华     E-mail: jhdong@imr.ac.cn
作者简介: 王长罡, 男, 1985年生, 博士

引用本文:

王长罡,董俊华,柯伟,李晓芳. HCO3-, SO42-和Cl-混合体系中Cu点蚀行为的研究[J]. 金属学报, 2013, 49(2): 207-213.
WANG Changgang, DONG Junhua, KE Wei, LI Xiaofang. INVESTIGATION ON PITTING CORROSION BEHAVIOR OF COPPER IN THE MIXED SOLUTION OF HCO3-, SO42- AND Cl-. Acta Metall Sin, 2013, 49(2): 207-213.

链接本文:

https://www.ams.org.cn/CN/10.3724/SP.J.1037.2012.00357      或      https://www.ams.org.cn/CN/Y2013/V49/I2/207

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