电子封装微互连焊点力学行为的尺寸效应

金属学报

2009, Vol. 45

Issue (4): 422-427

论文

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电子封装微互连焊点力学行为的尺寸效应

尹立孟;杨艳;刘亮岐;张新平

华南理工大学材料科学与工程学院; 广州 510640

SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING

YIN Limeng; YANG Yan; LIU Liangqi; ZHANG Xinping

School of Materials Science and Engineering; South China University of Technology; Guangzhou 510640

引用本文:

尹立孟杨艳刘亮岐张新平. 电子封装微互连焊点力学行为的尺寸效应[J]. 金属学报, 2009, 45(4): 422-427.
, , , . SIZE EFFECT OF MECHANICAL BEHAVIOR OF MINIATURE SOLDER JOINT INTERCONNECTIONS IN ELECTRONIC PACKAGING[J]. Acta Metall Sin, 2009, 45(4): 422-427.

全文: PDF(1689 KB)

摘要:

研究了微互连模拟焊点在不同直径(d=200---575 μm)和长度(l=75---525 μm)匹配条件下准静态微拉伸的力学行为. 研究结果表明, 焊点几何尺度因子 $d/l$ 对焊点内的力学拘束及接头强度有重要影响; d/l增大时导致焊点中力学拘束和应力三轴度的提高, 但接头强度并不完全符合Orowan近似公式的预测结果, 保持l恒定而增加d时会出现强度变小的尺寸效应. 研究结果还表明, 无论无铅还是含铅钎料, 其焊点拉伸强度与焊点体积(d²l)之间的变化关系符合反比例函数, 即σ_F-Joint=1/(Ad²l+B), 焊点的强度随焊点体积的减小而显著增大, 显示了焊点“越小越强”的“体积”尺寸效应.

关键词 ：电子封装, 微互连焊点, 尺寸效应, 拉伸强度, 约束效应

Abstract：

Mechanical behaviors of miniature solder joint interconnections with different scale matches, diameter (d) in the range of 200—575 μm and length (l) of 75—525 μm, were investigated by using quasi–static micro–tensile testing. The results show that the joint geometry scaling factor (d/l) plays an important role in influencing the mechanical constraint level and tensile strength of the solder joints. However, with increasing d/l, the tensile strength of the joints does not always increase and not always exhibit a similar trend to that predicted by Orowan approximation equation, but there is an inverse size effect on the solder joint strength. For both lead–free and lead–containing solders, the correlation between the tensile strength and volume of the solder joints largely follows inverse proportion function equation, i.e., σ_F−Joint = 1/(Ad²l) + B, where tensile strength of the solder joints increases obviously with the decrease of the solder joint volume and there is a so–called "solder joint volume effect", that is, the smaller the solder joint volume, the higher the solder joit strenth.

Key words： electronic packaging miniature solder joint interconnection size effect tensile strength constraint effect

收稿日期: 2008-04-28

ZTFLH:

TG113

基金资助:

新世纪优秀人才计划资助项目NCET--04--0824

作者简介: 尹立孟, 男, 1976年生, 博士生

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