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| Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为 |
| 周敏波; 李勋平; 马骁; 张新平 |
| 华南理工大学材料科学与工程学院; 广州 510640 |
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| EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR OF Sn-3.5Ag/Cu SYSTEM |
| ZHOU Minbo; LI Xunping; MA Xiao; ZHANG Xinping |
| School of Materials Science and Engineering; South China University of Technology; Guangzhou 510640 |
引用本文:
周敏波 李勋平 马骁 张新平. Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为[J]. 金属学报, 2010, 46(5): 569-574.
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EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR OF Sn-3.5Ag/Cu SYSTEM[J]. Acta Metall Sin, 2010, 46(5): 569-574.
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