MODELING DYNAMIC RECRYSTALLIZATION OF PURE COPPER USING CELLULAR AUTOMATON METHOD

Acta Metall Sin

2008, Vol. 44

Issue (3): 292-296 DOI:

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MODELING DYNAMIC RECRYSTALLIZATION OF PURE COPPER USING CELLULAR AUTOMATON METHOD

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. MODELING DYNAMIC RECRYSTALLIZATION OF PURE COPPER USING CELLULAR AUTOMATON METHOD. Acta Metall Sin, 2008, 44(3): 292-296 .

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Abstract Based on the fundamental metallurgical principles of metal hot working process, a two-dimensional dynamic recrystallization(DRX) model of pure copper was built up by using cellular automata(CA) to simulate the microstructural evolution during thermomechanical processing with DRX. It could calculate the variation of the flow stress, the orientation and mean size of recrystallization grains(R-grains). The flow stress was evaluated from the average dislocation density of the matrix and all the R-grains. The dynamic recrystalization process for different strains, strain rates, temperatures were simulated. The predictions agree well with experimental results for pure copper at the same hot working condition. The model provides an elementary link for the microscopic dislocation activities, mesoscopic grain boundary movement dynamics, and macroscopic hot working parameters, and paves the way for the multiscale modeling in the future.

Key words: dynamic recrystallization cellular automata microstructure evolution growth kinetics

Received: 12 July 2007

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