Effect of Annealing Temperature on Tensile Fracture Behavior of ARB-Cu at Room Temperature

doi:10.11900/0412.1961.2016.00475

Acta Metall Sin

2017, Vol. 53

Issue (8): 1001-1010 DOI: 10.11900/0412.1961.2016.00475

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Effect of Annealing Temperature on Tensile Fracture Behavior of ARB-Cu at Room Temperature

Min LI, Jing LIU, Qingwei JIANG(

)

School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China

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Min LI, Jing LIU, Qingwei JIANG. Effect of Annealing Temperature on Tensile Fracture Behavior of ARB-Cu at Room Temperature. Acta Metall Sin, 2017, 53(8): 1001-1010.

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Abstract

Annealing treatment is an effective method for improving structural stability of ultrafine-grained (UFG) or nanostructured (NS) materials produced by severe plastic deformation (SPD). This work focuses on the effect of annealing temperature on the tensile fracture behavior of UFG Cu produced by accumulative roll bonding (ARB). Annealing treatment was performed for 10 min at temperatures of 100, 150, 200 and 250 ℃. The microstructure of annealed and ARBed UFG Cu was observed by TEM. The uniaxial static tensile test was performed by utilizing fatigue testing machine (IBTC-5000) with an initial strain rate of 10^-2 s^-1. Fracture morphology was observed by SEM. The results suggested that yield strength and tensile strength decreased after annealing treatment compared with initial sample. However, yield strength and tensile strength of ARB-Cu increased with increasing annealing temperature below recrystallization temperature. When annealing temperature is higher than recrystallization temperature, the strength decreased rapidly. With increasing the annealing temperature, the grain size of ARB-Cu increases and gradually tends to bimodal distribution, and the fracture morphology shows a trend of increasing plasticity gradually. The annealing treatment is helpful to bonding efficiency E. The relationship between the theoretical bonding efficiency E and the ARB passes n can be expressed in E=(1-0.5ⁿ)×100%.

Key words: ultrafine grain accumulative rolling bonding annealing microstructure fracture morphology

Received: 25 October 2016

ZTFLH:

TG146

Fund: Supported by National Natural Science Foundation of China (No.51201077)

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	Min LI
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	Qingwei JIANG

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https://www.ams.org.cn/EN/10.11900/0412.1961.2016.00475 OR https://www.ams.org.cn/EN/Y2017/V53/I8/1001

Fig.1 TEM images of accumulative roll bonding (ARB)-Cu with initial state (a, b), and annealed states at temperatures of 100 ℃ (c, d) and 200 ℃ (e, f)

Fig.2 Effect of annealing temperature on the grain size distribution of ARB-Cu

Fig.3 Engineering stress-strain curves of ARB-Cu with different annealing temperatures (a) and the curves of yield strength and tensile strength with annealing temperature (T_a) (b)

Fig.4 Low (a, c, e, g) and high (b, d, f, h) magnified SEM images of tensile fracture lateral morphology of ARB-Cu with initial state (a, b), and annealed state at temperatures of 100 ℃ (c, d), 200 ℃ (e, f) and 250 ℃ (g, h)

Fig.5 Low (a) and high (b) magnified SEM images of section surface morphologies of ARB-Cu with annealed state at temperature of 150 ℃

Fig.6 Low (a, c, e, g, i) and high (b, d, f, h, j) magnified SEM images of tensile fracture morphologies of ARB-Cu with initial state (a, b), and annealed state at temperatures of 100 ℃ (c, d), 150 ℃ (e, f), 200 ℃ (g, h) and 250 ℃ (i, j)

Fig.7 Schematic of bonding interface of ARB materials (a—length of sample before rolling per cycle, b—width of sample before rolling per cycle, c—thickness of sample after rolling per cycle)

Table 1 Bonding efficiencies (E) and rolling passes (n) of bonding faces of ARB materials (i—the passes formed the bonding interface)

Fig.8 Changes of the bonding strength indicator with the rolling passes (a) and bonding strength indicator of second bonding surface with annealing temperatures (b) (η—the bonding strength indicator of bonding interface, k—the constant related to rolling passes, σ_i—fracture strength of sample, σ₀—tensile strength of initial sample, T—annealing temperature)

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