MICROSTRUCTURE AND INDENTATION BEHAVIOUR OF MULTILAYER Ti-N FILM
WAGENDRISTEL A (Technische Universitat in Wien; Austria); HUANG Rongfang (Institute of Metal Research; Academia Sinica; Shenyang); BANGERT H; YANG Xia; WU Lihang; WANG Haifeng; PANGRATZ H; SKALICKY P (Technische Universitat in Wien; Austria)
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WAGENDRISTEL A (Technische Universitat in Wien; Austria); HUANG Rongfang (Institute of Metal Research; Academia Sinica; Shenyang); BANGERT H; YANG Xia; WU Lihang; WANG Haifeng; PANGRATZ H; SKALICKY P (Technische Universitat in Wien; Austria). MICROSTRUCTURE AND INDENTATION BEHAVIOUR OF MULTILAYER Ti-N FILM. Acta Metall Sin, 1992, 28(7): 78-84.
Abstract Observations of cross-sectional Ti/TiN film sample under TEM and of respective depth profiling by secondary ion mass spectroscopy showed that a periodic alternate multilayer structure, i.e., substrate/FeTi/Ti/Ti_2N/TiN/Ti_2N/Ti/Ti_2N/TIN…Ti/Ti_2N/TiN, where FeTi and Ti_2N being transition layer, was found during ion plating. SEM fractograph of indentation sample also showed that the hard coating deformed during indentation, an indentation dip and a pile-up of materials around appeared. With the increase of load applied, the deformation region extended beyond film/substrate boundary and into substrate, initiated interlayer cracking in film and formation of hole at film/substrate interface. It seems that the multilayered Ti/TiN film offered better toughness than single layer TiN film.
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