EFFECTS OF ANNEALING TEMPERATURE ON THE MICROSTRUCTURES AND PROPERTIES OF COPPER CLADDING ALUMINUM WIRES BY COLD HYDROSTATIC EXTRUSION

Acta Metall Sin

2008, Vol. 44

Issue (6): 675-680 DOI:

Research Articles

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EFFECTS OF ANNEALING TEMPERATURE ON THE MICROSTRUCTURES AND PROPERTIES OF COPPER CLADDING ALUMINUM WIRES BY COLD HYDROSTATIC EXTRUSION

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北京科技大学材料科学与工程学院

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;. EFFECTS OF ANNEALING TEMPERATURE ON THE MICROSTRUCTURES AND PROPERTIES OF COPPER CLADDING ALUMINUM WIRES BY COLD HYDROSTATIC EXTRUSION. Acta Metall Sin, 2008, 44(6): 675-680 .

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Abstract The effects of annealing temperature on the microstructures and properties of copper cladding aluminum wires fabricated by cold hydrostatic extrusion were investigated, and the influence mechanism was discussed based on the different interface fracture modes. The experimental results show that the appropriate annealing temperature is 350℃ for as-extruded wires. At a annealing temperature below 200℃, a recovery process is dominant in copper sheath and the mechanical properties partly recovered. The recrystallization of copper proceeded sufficiently at 350℃, the tensile strength reaches a minimum and the elongation gets its maximum. The growth of copper grains occurred during annealing at 400℃, which decreases the elongation of the alloy. With the annealing temperature increased, the interface strength of the Cu/Al bimetal wires increased to a maximum value and then decreased, the interface fracture location transformed from Al-side to the Cu/Al interface and at the same time the fracture mode transformed from ductile to brittle.

Key words: hydrostatic extrusion copper cladding aluminum wire annealing temperature microstructure mechanical

Received: 09 November 2007

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