Evolution and Healing Mechanism of 1Cr22Mn16N High Nitrogen Austenitic Stainless Steel Interface Microstructure During Plastic Deformation Bonding
YANG Ruize1,2,3, ZHAI Ruzong1,2, REN Shaofei1,2, SUN Mingyue1,2(), XU Bin1,2, QIAO Yanxin3(), YANG Lanlan3
1 Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China 2 CAS Key Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China 3 School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
Cite this article:
YANG Ruize, ZHAI Ruzong, REN Shaofei, SUN Mingyue, XU Bin, QIAO Yanxin, YANG Lanlan. Evolution and Healing Mechanism of 1Cr22Mn16N High Nitrogen Austenitic Stainless Steel Interface Microstructure During Plastic Deformation Bonding. Acta Metall Sin, 2024, 60(7): 915-925.
High nitrogen austenitic stainless steels (HNASSs) are widely used for their good wear resistance and high strength, plasticity, and corrosion resistance. Among these steels, 1Cr22Mn16N HNASS improves the cost effectiveness because of the incorporation of a N element in place of the expensive Ni element. In addition, the overall mechanical properties of the steel are further improved because of the solid solution-strengthening effect of the N element. However, the traditional welding methods such as arc welding, tungsten gas shielded welding, and friction stir welding are not suitable for 1Cr22Mn16N HNASS welding because of the different solubility of N in the liquid and solid phases. N easily spills out during the welding process, which considerably degrades the mechanical properties of the welded joints. Therefore, a new welding method needs to be explored to solve the problems in 1Cr22Mn16N welding. In this work, the bonding technology of plastic deformation was introduced to solve the poor performance problems of 1Cr22Mn16N HNASS welded joints. The experiments were conducted through the Glebble 3500 thermomechanical simulation in the temperature range of 1050-1250oC and a strain range of 10%-40% with a strain rate of 0.1 s-1. The microstructure evolution of the bonding interface was characterized and investigated using OM, EBSD, and TEM; the interface healing mechanism was discussed, and the bonding strength of the joint was evaluated by tensile test. The results show that the bonding level of the interface substantially increases with the increase in deformation and temperature. When the deformation temperature reached 1200oC and the strain reached 40%, the mechanical properties of the bonding interface reached up to the same level as the matrix. During the process of deformation, discontinuous dynamic recrystallization (DDRX) occurred at the interface because of thermomechanical coupling; meanwhile, dislocations accumulated and entanglement occurred under the action of stress, forming a large number of subgrain boundaries within the original grain boundaries near the interface, which, lead to continuous dynamic recrystallization (CDRX). The healing of the interface was achieved by the synergistic effect of CDRX and DDRX.
Fund: National Key Research and Development Program of China(2018YFA0702900);National Natural Science Foundation of China(52173305);National Natural Science Foundation of China(52101061);National Natural Science Foundation of China(52233017);National Natural Science Foundation of China(52203384)
Corresponding Authors:
SUN Mingyue, professor, Tel: (024)83971018, E-mail: mysun@imr.ac.cn;
Fig.1 Schematics of the experimental method and sample size (unit: mm) (a) experimental method of plastic deformation bonding (b) samples before and after deformation (c) experimental method of tensile butt-joint (The top schematic shows a butt-joint specimen; the bottom schematic shows the sample of the base material) (d) tensile sample before compression
Fig.2 Inverse pole figure (IPF) of microstructure of 1Cr22Mn16N high nitrogen austenitic stainless steel (HNASS)
Fig.3 OM images of interface in 1Cr22Mn16N HNASS at different deformation temperatures with 0.1 s-1 strain rate and 20% strain
Fig.4 OM images of interface in 1Cr22Mn16N HNASS at 1200oC and deformations of 10% (a), 20% (b), 30% (c), and 40% (d); and average grain size diagram (e)
Fig.5 Room temperature tensile curves of the bonding joints (BJs) and base materials (BMs) with deformations of 20% and 40%
Fig.6 Tensile fracture morphologies of BJs (a, c) and BMs (b, d) at deformations of 20% (a, b) and 40% (c, d) (Insets show the macrostructures of fracture)
Fig.7 IPFs (a, d, g, j),geometrically necessary dislocation (GND) maps (b, e, h, k), and grain orientation spread (GOS) maps (c, f, i, l) of interface microstructures under deformations of 10% (a-c), 20% (d-f), 30% (g-i), and 40% (j-l) at 1200oC (CDRX—continuous dynamic recrystallization, DDRX—discontinuous dynamic recrystallization, LAGB—low angle grain boundary, MAGB—middle angle grain boundary, HAGB—high angle grain boundary)
Fig.8 Misorientation angle distributions of samples under different deformations at 1200oC (Inset shows the magnified MAGB occupancy)
Fig.9 TEM images of interface structure at 1200oC and 20% strain (a) DRX grain (b) subgrain boundary
Fig.10 Schematics of healing mechanism of bonding interface during plastic deformation bonding (a) deformation (b) grain boundary bow (c) dislocation accumulation (d) increased dynamic recrystallization (DRX) (e) interface bonding
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