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ZA22/Al_2O_3(F)复合材料室温拉伸强度的模拟研究 |
陈凯;俞蒙槐;胡上序;于思荣;何镇明 |
浙江大学;杭州;310027;浙江大学;杭州;310027;浙江大学;杭州;310027;吉林工业大学;长春;130025;吉林工业大学;长春;130025 |
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SIMULATION OF ROOM-TEMPERATURE STRENGTH OF ZA22/Al_20_3(F) COMPOSITES |
CHEN Kai;YU Menghuai;HU Shangxu (Zhejiang University; Hangzhou 310027)YU Sirong; HE Zhenming(Jilin University of Technology; Changchun 130025)(Manuscript received 1996-04-30; in revise form 1996-09-28) |
引用本文:
陈凯;俞蒙槐;胡上序;于思荣;何镇明. ZA22/Al_2O_3(F)复合材料室温拉伸强度的模拟研究[J]. 金属学报, 1997, 33(4): 437-442.
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SIMULATION OF ROOM-TEMPERATURE STRENGTH OF ZA22/Al_20_3(F) COMPOSITES[J]. Acta Metall Sin, 1997, 33(4): 437-442.
1 William J B.Metall Trans,1992;23A:3045 2 Termonia Y.J Mater Sci,1990;25:4644 3 焦李成.神经网络的应用与实现.西安:西安电子科技大学出版社,1995:2 4 Friend C M.J Mater Sci,1989;22:3005 5 陈凯.吉林工业大学硕士学位论文,1994:58 6 于思荣,何镇明,孟长生,陈凯.中国稀土学报,1994:12:323 7 焦李成.神经网络系统理论.西安:西安电子科技大学出版社,1995:34} |
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