高硬导电<strong>Cu-Ni-Si</strong>合金成分规律

doi:10.11900/0412.1961.2019.00080

金属学报

2019, Vol. 55

Issue (10): 1291-1301 DOI: 10.11900/0412.1961.2019.00080

本期目录 | 过刊浏览

高硬导电Cu-Ni-Si合金成分规律

李冬梅^1,²,姜贝贝¹,李晓娜¹,王清¹,董闯¹(

)

1. 大连理工大学材料科学与工程学院三束材料改性教育部重点实验室大连 116024
2. 内蒙古民族大学机械工程学院通辽 028000

Composition Rule of High Hardness and Electrical Conductivity Cu-Ni-Si Alloys

LI Dongmei^1,²,JIANG Beibei¹,LI Xiaona¹,WANG Qing¹,DONG Chuang¹(

)

1. Key Lab of Materials Modification by Laser, Iron and Electron Beams (Ministry of Education), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
2. School of Mechanical Engineering, Inner Mongolia University For Nationalities, Tongliao 028000, China

引用本文:

李冬梅, 姜贝贝, 李晓娜, 王清, 董闯. 高硬导电Cu-Ni-Si合金成分规律[J]. 金属学报, 2019, 55(10): 1291-1301.
Dongmei LI, Beibei JIANG, Xiaona LI, Qing WANG, Chuang DONG. Composition Rule of High Hardness and Electrical Conductivity Cu-Ni-Si Alloys[J]. Acta Metall Sin, 2019, 55(10): 1291-1301.

全文: PDF(12680 KB) HTML

摘要:

用团簇加连接原子模型设计了系列用于制作引线框架的Cu-Ni-Si合金。在Cu含量小于95%的浓溶质区，采用单团簇模型[(Ni_2/3Si_1/3)-Cu₁₂]Cu_1~6设计合金成分；在Cu含量大于或等于95%的稀溶质区，采用双团簇模型{[(Ni_2/3Si_1/3)-Cu₁₂]Cu₃}_A+{[Cu-Cu₁₂]Cu₃}_B设计合金成分。利用XRD、OM、TEM、Vickers硬度计、电导率测量仪等实验获得Cu-Ni-Si合金的成分规律。结果表明，在Cu-Ni-Si合金的成分范围内存在Cu含量为95.0%~95.8%的成分敏感区，此区间内合金同时存在时效析出强化和调幅分解强化，致使Vickers硬度突然增加，导电率降低，两者变化趋势相反，且与成分之间无规律性依赖关系。成分敏感区前后的浓溶质区和稀溶质区的合金中，不存在调幅分解强化，Vickers硬度(H)随Cu含量(C_Cu)增加而减少，分别满足H=_{-12.6C_Cu+1362.7和H=-26.2C_Cu+2777.3的线性关系；相应的导电率(σ)随C_Cu的线性增加关系分别为σ=0.2C_Cu+28.6和σ=5.2C_Cu-466。}

关键词 ： Cu-Ni-Si合金, 成分规律, 硬度, 导电率, 成分敏感区

Abstract：

Cu-Ni-Si alloys are among the most widely used electrical conductive (>30%IACS) alloys with quite high strength level (>500 MPa), so they are especially suitable for lead frames and connector joints. However, these two properties are quite composition sensitive, apart from their tight connection with processing. Moreover, their compositions fall within quite broad ranges that poses difficulties for the industries. For instance, typical C7025 alloy has a specified composition (mass fraction, %) range of Ni 2.2~4.2, Si 0.25~1.2, Mg 0.05~0.3, plus less than 0.5 of other impurity elements. Obviously the composition ranges of the elements are far from even their absolute contents. The present work focuses on understanding the composition rule of Cu-Ni-Si via a new structural tool, the cluster-plus-glue-atom model. In this model, any solid solution is described by a nearest neighbor coordination polyhedron plus a one-to-six glue atoms. Specifically for Cu-based alloys, the cluster is cubooctahedron. The composition formula for solute-rich Cu-Ni-Si alloys and pure Cu are established, respectively [(Ni_2/3Si_1/3)-Cu₁₂]Cu_1~6 and [Cu-Cu₁₂]Cu₃. A series of Cu-Ni-Si alloys were designed on the basis of the cluster-plus-glue-atom model. In the concentrated solute region with Cu content less than 95%, the alloys were designed using the single cluster model [(Ni_2/3Si_1/3)-Cu₁₂]Cu_1~6. In the dilute solute region where Cu content is larger than or equal to 95%, the alloys were designed using the double cluster model {[(Ni_2/3Si_1/3)-Cu₁₂]Cu₃}_A+{[Cu-Cu₁₂]Cu₃}_B. The alloys were arc-melted into ingots under Ar atmosphere and were subjected to a solution treatment at 950 ℃ for 1 h plus water quenching, and then to an ageing at 450 ℃ for 4 h plus water quenching. The microstructure and properties of the alloys were characterized and tested by XRD, OM, TEM, Vickers hardness tester and digital metal conductivity instrument. The composition rule of the designed Cu-Ni-Si alloy was obtained by experiments.The results shown a special range of Cu content in 95.0%~95.8% as a composition sensitive region, in which, in addition to ageing precipitation strengthening, the alloys also have amplitude modulated decomposition strengthening, resulting in a sudden increase in Vickers hardness and a decrease in electrical conductivity. Vickers hardness and electrical conductivity change with composition variations in an irregular manner. In the concentrated and dilute solute region before and after the composition sensitive region, Vickers hardness (H) is linearly related to the Cu content (C_Cu) by H=-12.6C_Cu+1362.7 and H=-26.2C_Cu+2777.3, and the corresponding electrical conductivity (σ) is also linearly related to the C_Cu by σ=0.2C_Cu+28.6 and σ=5.2C_Cu-466.

Key words： Cu-Ni-Si alloy composition rule hardness electrical conductivity composition sensitive region

收稿日期: 2019-03-25

ZTFLH:

TG146.1

基金资助:国家重点研发计划项目(2017YFB0306100);National Key Research and Development Program of China(2017YFB0306100);国家自然科学基金项目(11674045);National Natural Science Foundation of China(11674045)

作者简介: 李冬梅，女，1973年生，博士生

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https://www.ams.org.cn/CN/10.11900/0412.1961.2019.00080 或 https://www.ams.org.cn/CN/Y2019/V55/I10/1291

表1 Cu-Ni-Si 系商用牌号合金的成分、Ni/Si比、导电性和Vickers硬度[18,19,20,21,22,23,24,25,26]

图1 Ni-Si团簇结构单元散布于基体Cu中的二维投影示意图

表2 设计的 Cu-Ni-Si 合金的团簇成分式、成分、导电性、Vickers硬度和半峰宽

图2 450 ℃时效处理4 h后Cu-Ni-Si合金的XRD谱

图3 Cu-Ni-Si合金经450 ℃时效处理4 h后的OM像

图4 No.9和No.10合金在450 ℃时效处理4 h后的TEM像和对应的SAED谱

图5 450 ℃时效处理4 h后Cu-Ni-Si合金的硬度和导电率随CCu的变化

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