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扩散处理对Ag-Cu复合板界面区组织与成分的影响 |
孟亮 陈燕俊 刘茂森 周世平 杨富陶 林德仲 |
浙江大学金属材料研究所;杭州310027 |
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引用本文:
孟亮; 陈燕俊; 刘茂森; 周世平; 杨富陶; 林德仲 . 扩散处理对Ag-Cu复合板界面区组织与成分的影响[J]. 金属学报, 2001, 37(1): 47-51 .
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