The corrosion behavior of Cu in different concentration of NaCl and the inhibition of PASP were studied by photoelectrochemical method. The copper electrode in a borax buffer solution showed p-type photoresponse which came from Cu2O layer on its surface. When a little NaCl(<0.5g/L) was added, the Cu2O layer didn’t change its semiconductor style; When more NaCl(0.5-15g/L) was added, a part of the Cu2O layer changed into n-type because of the doping of the Cl- . When a large amount of NaCl(>15g/L) was added, the Cu2O layer totally changed into n-type. When the concentration of NaCl was 2g/L, PASP played a competitive adsorption with Cl- and prevented Cu2O layer from being doped, so the Cu2O layer showed p-type. When the concentration of NaCl was 30g/L, the competitive adsorption of PASP only prevented Cu2O layer from doping slightly, the Cu2O layer still changed into n-type, but the n-type was weakened..
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