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DIFFUSION BONDING OF Si_3N_4 AND 40Cr STEEL WITH AMORPHOUS Cu_(50)Ti_(50)B INTERLAYER |
ZHAI Yang;REN Jialie; ZHUANG Lijun; CAO Yuqing;SUN Lijun(Tsinghua University; Beijing 100084)(Manuscript received 1994-10-09; in revised form 1995-0 1-20) |
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Cite this article:
ZHAI Yang;REN Jialie; ZHUANG Lijun; CAO Yuqing;SUN Lijun(Tsinghua University; Beijing 100084)(Manuscript received 1994-10-09; in revised form 1995-0 1-20). DIFFUSION BONDING OF Si_3N_4 AND 40Cr STEEL WITH AMORPHOUS Cu_(50)Ti_(50)B INTERLAYER. Acta Metall Sin, 1995, 31(21): 423-428.
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Abstract In this paper. Si3N4has been joined successfully to 40Cr steel with amorphous Cu50Ti50B foil and ductile metal Ni interlayer by diffusion bonding at the first time. The experimental results showed that bonding time, temperature and thickness of Ni interlayer had influence on the strength of joint considerably. The optimum bonding parameters and thickness of Ni interlayer were 900℃. 40 min, 30 MPa and 1 mm, respectively. The analysis of microstructure of joint showed that the decrease of joining strength was due to the interaction between amorphous Cu50Ti50B and Ni interlayer, which reduced the activity of element Ti in the amorphous Cu50Ti50B foil and formed brittle intermetallics. The strength of joint was enhanced by using Mo insert-layer to restrain the interaction between amorphous Cu50Ti50B foil and Ni interlayer. New laminated interlayer model for diffusion bonding of ceramic to metal is proposed as follows:ceramic/active interlayer /isolation interlayer/ductile metal interlayer/metal.Correspondent:(ZHAI Yang, Faculty of Welding, Tsinghua University, Beijing 100084)
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1AKSELSENOM.JMaterSci,1992;27:5692AKSELSENOM.JMaterSci,1992:27:19893SuganumaK,OkamotoT.KoizumiM.JMaterSciLett,1985;4:6484SuganumaK,OkamotoT,MiyamotoY,ShimadaM,KoizumiM.MaterSciTech,1986;2:11565FrankW,HorvathJ,KronmullerH.MaterSciEng,1988;97:4156翟阳.任家烈,庄丽君金属学报,1994;30:B361 |
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