Dislocation Pattern in Deformation Band and Crack Nucleation in a Fatigued Copper Bicrystal with Perpendicular Grain Boundary

Acta Metall Sin

2004, Vol. 40

Issue (5): 462-466 DOI:

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Dislocation Pattern in Deformation Band and Crack Nucleation in a Fatigued Copper Bicrystal with Perpendicular Grain Boundary

LI Yong; LI Shouxin; LI Guangyi

Shenyang National Laboratory for Materials Science; Institute of Metal Research; The Chinese Academy of Sciences; Shenyang 110016

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LI Yong; LI Shouxin; LI Guangyi. Dislocation Pattern in Deformation Band and Crack Nucleation in a Fatigued Copper Bicrystal with Perpendicular Grain Boundary. Acta Metall Sin, 2004, 40(5): 462-466 .

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Abstract The dislocation pattern evolution and crack nucleation in a fatigued copper bicrystal with perpendicular grain boundary (GB) have been investigated by electron channelling contrast (ECC) technique in SEM. The observation results show that in the process from the formation of deformation band (DB) to the appearance of fatigued crack, the spacing between the wall structures in DB keeps constant. The dislocation pattern around the crack tips of transgranular and granular presents misorientation cell structure. The crack preferentially form in DB.

Key words: copper bicrystal dislocation pattern crack

Received: 18 April 2003

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