Molecular Dynamics Simulation of Healing of an Ellipsoid Crack in Copper Crystal Under Compressive Stress

Acta Metall Sin

2004, Vol. 40

Issue (5): 449-451 DOI:

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Molecular Dynamics Simulation of Healing of an Ellipsoid Crack in Copper Crystal Under Compressive Stress

LI Ming; CHU Wuyang; GAO Kewei; SU Yanjing; QIAO Lijie

Department of Materials Physics; University of Science and Technology Beijing; Beijing 100083

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LI Ming; CHU Wuyang; GAO Kewei; SU Yanjing; QIAO Lijie. Molecular Dynamics Simulation of Healing of an Ellipsoid Crack in Copper Crystal Under Compressive Stress. Acta Metall Sin, 2004, 40(5): 449-451 .

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Abstract The molecular dynamics method is used to simulate healing of an ellipsoid crack inside single crystal copper under compressive stress with EAM potential. The result shows that dislocations are emitted firstly from the ellipsoid crack and move along the (1-11) and (-111) planes under a constant compressive stress of 342 MPa. The ellipsoid crack becomes smaller and smaller until it is healed through dislocation emission, motion, and annihilation on the surfaces. After crack healing, there are a residual dislocation net and some vacancy sites. It seems that the cavity inside the ellipsoid crack is transferred to the surfaces through dislocation emission, motion, and annihilation. In the same time, the crystal undergoes large plastic deformation and the surfaces become rough because of dislocation annihilation.

Key words: ellipsoid crack healing copper

Received: 13 May 2003

ZTFLH:	TG146.11
	TG111.91

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	LI Ming
	CHU Wuyang
	GAO Kewei
	SU Yanjing
	QIAO Lijie

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https://www.ams.org.cn/EN/ OR https://www.ams.org.cn/EN/Y2004/V40/I5/449

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