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Acta Metall Sin  1992, Vol. 28 Issue (1): 90-94    DOI:
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ATOMIC REACTION MODEL FOR DIFFUSION BONDING OF METALS
HUANG Yan;CUI Jianzhong;MA Longxiang Northeast University of Technology; Shenyang
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HUANG Yan;CUI Jianzhong;MA Longxiang Northeast University of Technology; Shenyang. ATOMIC REACTION MODEL FOR DIFFUSION BONDING OF METALS. Acta Metall Sin, 1992, 28(1): 90-94.

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Abstract  According to probabilty theory and atomic activation on bonding interface of metals, a mathematical model was developed for the atomic interfacial reaction during diffustion bonding. The effect of parameters of bonding processing and material on the bonding strength was then gained. It was suggested that the activation centre of atomic interfacial reac-tion of bonding may be, in situ, the boundary dislocaion and its elastic stress field. A substantial agreement about the quantitative prediction of the model was made with the results of diffusionbonding experiments for 7075 Al alloy
Key words:  diffusion bonding      atomic reaction      Al alloy     
Received:  18 January 1992     
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