EFFECT OF HEAVILY DRAWING ON THE MICROSTRUCTURE AND PROPERTIES OF Cu–Cr ALLOYS

doi:10.3724/SP.J.1037.2012.00263

Acta Metall Sin

2012, Vol. 48

Issue (12): 1459-1466 DOI: 10.3724/SP.J.1037.2012.00263

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EFFECT OF HEAVILY DRAWING ON THE MICROSTRUCTURE AND PROPERTIES OF Cu–Cr ALLOYS

SONG Lunan ¹, LIU Jiabin ^1,2, HUANG Liuyi ^1,3, ZENG Yuewu ¹, MENG Liang ¹

1) Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027
2) Department of Mechanics Science and Engineering, Zhejiang University, Hangzhou 310027
3) Zhejiang Special Equipment Inspection and Research Institute, Hangzhou 310015

Cite this article:

SONG Lunan LIU Jiabin HUANG Liuyi ZENG Yuewu MENG Liang. EFFECT OF HEAVILY DRAWING ON THE MICROSTRUCTURE AND PROPERTIES OF Cu–Cr ALLOYS. Acta Metall Sin, 2012, 48(12): 1459-1466.

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Abstract

Cu–Cr alloy is a kind of promising materials used as conductor due to its good strength and high conductivity. Heavy cold deformation could increase the strength effectively. Most of Cu and Cr phase are elongated into filaments during cold drawing. There exits plenty of Cu/Cr interface and the structure of Cu/Cr interface is thought to play an essential role in the properties of the Cu–Cr alloy. In this work, Cu–Cr wires were prepared by cold drawing method. The evolution of the microstructure and the structural change of phase interface during cold drawing have been investigated and the relationship between properties and microstructure also established. The microstructure consists of Cu matrix and Cr particles before cold drawing. As the drawing strain increases, both of Cu and Cr phases evolve into filamentary structure. Some residual Cr particles are still found in the alloy even at high drawing ratio. There is a relationship of (111)_Cu//(110)_Cr between Cu fibers and Cr fibers at high strain levels. The Cu/Cr interface is non–coherent before cold drawing and gradually evolves into the coherent interface at high drawing strains. The inter–solution ability of Cu and Cr elements across the Cu/Cr interface is enhanced with the increase in the drawing strain. The coherent Cu/Cr interface and the increasing of interface density should be responsible for the strength rising to an almost constant value and the increase in electrical resistivity of Cu–Cr alloys at high strain levels.

Key words: Cu–Cr alloy strength conductivity phase interface

Received: 10 May 2012

ZTFLH:

TG146.1

Fund:

Supported by National Natural Science Foundation of China (Nos.11202183 and 50671092), Key Technologies R&D Program (No.2009BAG12A09) and Natural Science Foundation of Zhejiang Province (No.Y4100193)

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https://www.ams.org.cn/EN/10.3724/SP.J.1037.2012.00263 OR https://www.ams.org.cn/EN/Y2012/V48/I12/1459

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