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Ni-P消耗对焊点电迁移失效机理的影响 |
黄明亮,周少明,陈雷达,张志杰 |
大连理工大学材料科学与工程学院, 大连 116024 |
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EFFECT OF ELECTROLESS Ni-P CONSUMPTION ON THE FAILURE MECHANISM OF SOLDER JOINTS DURING ELECTROMIGRATION |
HUANG Mingliang, ZHOU Shaoming, CHEN Leida, ZHANG Zhijie |
School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024 |
引用本文:
黄明亮,周少明,陈雷达,张志杰. Ni-P消耗对焊点电迁移失效机理的影响[J]. 金属学报, 2013, 49(1): 81-86.
HUANG Mingliang,
ZHOU Shaoming,
CHEN Leida,
ZHANG Zhijie.
EFFECT OF ELECTROLESS Ni-P CONSUMPTION ON THE FAILURE MECHANISM OF SOLDER JOINTS DURING ELECTROMIGRATION[J]. Acta Metall Sin, 2013, 49(1): 81-86.
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