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电迁移对Ni/Sn3.0Ag0.5Cu/Cu焊点界面反应的影响 |
黄明亮, 陈雷达, 周少明 |
大连理工大学材料科学与工程学院, 大连 116024 |
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EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS |
HUANG Mingliang, CHEN Leida, ZHOU Shaoming |
School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024 |
引用本文:
黄明亮 陈雷达 周少明. 电迁移对Ni/Sn3.0Ag0.5Cu/Cu焊点界面反应的影响[J]. 金属学报, 2012, 48(3): 321-328.
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EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS[J]. Acta Metall Sin, 2012, 48(3): 321-328.
[1] Zeng K, Tu K N. Mater Sci Eng Rep, 2002; 38(2): 55[2] Chen C, Tong H M, Tu K N. Annu Rev Mater Res, 2010; 40: 531[3] Tu K N, Gusak A M, Li M. J Appl Phys, 2003; 93: 1335[4] He HW, Xu G C, Guo F. Acta Metall Sin, 2009; 45: 744(何洪文, 徐广臣, 郭 福. 金属学报, 2009; 45: 744)[5] Gan H, Tu K N. J Appl Phys, 2005; 97: 063514[6] Yang Q L, Shang J K. J Electron Mater, 2005; 34: 1363[7] Lin Y H, Hu Y C, Tsai C M, Kao C R, Tu K N. Acta Mater, 2005; 53: 2029[8] Lu Y D, He X Q, En Y F, Wang X, Zhuang Z Q. Acta Metall Sin, 2009; 45: 178(陆裕东, 何小琦, 恩云飞, 王歆, 庄志强. 金属学报, 2009; 45: 178)[9] Zhang L Y, Ou S Q, Huang J, Tu K N, Gee S, Nguyen L. Appl Phys Lett, 2006; 88: 012106[10] Hung Y M, Chen C M. J Electron Mater, 2008; 37: 887[11] Hu Y C, Lin Y H, Kao C R, Tu K N. J Mater Res, 2003; 18: 2544[12] Chen L D, Huang M L, Zhou S M. J Alloys Compd, 2010; 504: 535[13] Zhang X F, Guo J D, Shang J K. J Mater Res, 2008; 23: 3370[14] Zhang F, Li M, Chum C C, Tung C H. J Mater Res, 2003; 18: 1333[15] Wang S J, Liu C Y. J Electron Mater, 2003; 32: 1303[16] Wang S J, Liu C Y. J Electron Mater, 2006; 35: 1955[17] Chen H T,Wang C Q, Yan C, Li M Y, Huang Y. J Electron Mater, 2007; 36: 26[18] Hong K K, Ryu J B, Park C Y, Huh J Y. J Electron Mater, 2008; 37: 61[19] Chang C W, Yang S C, Tu C T, Kao C R. J Electron Mater, 2007; 36: 1455[20] Zhang X F, Guo J D, Shang J K. J Electron Mater, 2009; 38: 425[21] Wu W H, Chung H L, Chen C N, Ho C E. J Electron Mater, 2009; 38: 2563[22] Lee T Y, Tu K N, Frear D R. J Appl Phys, 2001; 90: 4502[23] Harcuba P, Janecek M. J Electron Mater, 2010; 39: 2553[24] Tsai J Y, Hu Y C, Tsai C M, Kao C R. J Electron Mater, 2003; 32: 1203[25] Yeh E C C, Choi W J, Tu K N, Elenius P, Balkan H. Appl Phys Lett, 2002; 80: 580[26] Ho P S, Kwok T. Rep Prog Phys, 1989; 52: 301[27] Huang J R, Tsai C M, Lin Y W, Kao C R. J Mater Res, 2008; 23: 250 |
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