|
|
PITTING CORROSION BEHAVIOR OF Sn–0.7Cu LEAD–FREE ALLOY IN SIMULATED MARINE ATMOSPHERIC ENVIROMENT AND THE EFFECT OF TRACE Ga |
YAN Zhong, XIAN Aiping |
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 |
|
Cite this article:
YAN Zhong XIAN Aiping. PITTING CORROSION BEHAVIOR OF Sn–0.7Cu LEAD–FREE ALLOY IN SIMULATED MARINE ATMOSPHERIC ENVIROMENT AND THE EFFECT OF TRACE Ga. Acta Metall Sin, 2011, 47(10): 1327-1334.
|
Abstract The corrosion behaviors of Sn–0.7Cu and Sn–0.7Cu–0.01Ga alloys have been investigated by salt spray dry–wet test with artificial seawater to simulate marine atmospheric environment. The surface corrosion products were analyzed by SEM, XPS and XRD. The results show that, at the early stage of corrosion process, the pits easily form at the Cu enrichment area on the surface of Sn–0.7Cu alloy, then the pits propagate by the way of the tentacles. Latter the corrosion product cracks, laminates and falls off, so that it does not give resistance to the future corrosion. XRD result shows that the corrosion products are mainly composed of amorphous oxide of Sn and a few SnCl2·2H2O. The addition of trace Ga in the Sn–0.7Cu alloy can significantly improve the corrosion resistance of the alloy in the salt spray test. XPS result shows that trace Ga segregated highly on surface and existed a protective oxide film that can improve the corrosion resistance of the Sn–0.7Cu alloy.
|
Received: 06 April 2011
|
Fund: Supported by Projects of Strategy Cooperation Between Guangdong Province and Chinese Academy of Science (No.2009B091300039) |
[1] Abtew M, Selvaduray G. Mater Sci Eng, 2000; 27R: 95[2] Rizvil M J, Bailey C, Chan Y C, Lu H. J Alloys Compd,2007; 438: 116[3] Lin C H, Chen S W, Wang C H. J Electron Mater, 2002;31: 907[4] Ning B, Chen X, Zhou F. J Electron Mater, 2008; 37: 1012[5] Andersson C, Sun P, Liu J. J Alloys Compd, 2008; 457:97[6] Ho C E, Yang S C, Kao C R. J Mater Sci: Mater Electron,2007; 18: 155[7] Nishikawa H, Piao J Y, Takemoto T. J Electron Mater,2006; 35: 1127[8] Jang J W, Ramanathan L N. J Appl Phys, 2008; 103:123506[9] Hasiao Y H, Tseng H W, Liu C Y. J Electron Mater, 2009;38: 2573[10] Liu M, Xian A P. J Electron Mater, 2009, 38: 2353[11] Liang S W, Chen C, Han J K, Xu L H, Tu K N, Lai Y S.J Appl Phys, 2010; 107: 093715[12] Xian A P, Gong G L. J Electron Mater, 2007; 36: 1669[13] Gong G L, Xian A P. Acta Metall Sin, 2007; 43: 759(贡国良, 冼爱平. 金属学报, 2007; 43: 759)[14] Wanees S A, Mohamed A E, Azeem M A, Fatah A N. Int J Electrochem Sci, 2008; 3: 1005[15] Wu B Y, Chan Y C, Alam M O. J Mater Res, 2006; 21: 62[16] Hassan H H, Fahmy K. Int J Electrochem Sci, 2008; 3: 29[17] Li D Z, Conway P P, Liu C Q. Corros Sci, 2008; 50: 995[18] Mohanty U S, Lin K L. Corros Sci, 2006; 48: 662[19] Fazioa E, Neria F, Ruggeria R, Sabatinob G, Trussoc S, Manninod G. Appl Surf Sci, 2011; 257: 2520[20] Morimoto H, Tatsumisago M, Minami T. Electrochem Solid–State Lett, 2001; 4A: 16[21] Dolbec R, ElKhakani M A, Serventi A M, Trudeau M, Saint–Jacques R G. Thin Solid Films, 2002; 49: 230[22] Fan H Y, Wang G N, Hu L L. Solid–State Sci, 2009; 11: 2065[23] Chang H, Chen H T, Li M Y, Wang N, Fu Y G. J Electron Mater, 2009; 38: 2170[24] Wagner C. J Chem Phys, 1950; 18: 62 |
No Suggested Reading articles found! |
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|