PITTING CORROSION BEHAVIOR OF Sn–0.7Cu LEAD–FREE ALLOY IN SIMULATED MARINE ATMOSPHERIC ENVIROMENT AND THE EFFECT OF TRACE Ga

doi:10.3724/SP.J.1037.2011.00201

Acta Metall Sin

2011, Vol. 47

Issue (10): 1327-1334 DOI: 10.3724/SP.J.1037.2011.00201

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PITTING CORROSION BEHAVIOR OF Sn–0.7Cu LEAD–FREE ALLOY IN SIMULATED MARINE ATMOSPHERIC ENVIROMENT AND THE EFFECT OF TRACE Ga

YAN Zhong, XIAN Aiping

Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016

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YAN Zhong XIAN Aiping. PITTING CORROSION BEHAVIOR OF Sn–0.7Cu LEAD–FREE ALLOY IN SIMULATED MARINE ATMOSPHERIC ENVIROMENT AND THE EFFECT OF TRACE Ga. Acta Metall Sin, 2011, 47(10): 1327-1334.

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Abstract The corrosion behaviors of Sn–0.7Cu and Sn–0.7Cu–0.01Ga alloys have been investigated by salt spray dry–wet test with artificial seawater to simulate marine atmospheric environment. The surface corrosion products were analyzed by SEM, XPS and XRD. The results show that, at the early stage of corrosion process, the pits easily form at the Cu enrichment area on the surface of Sn–0.7Cu alloy, then the pits propagate by the way of the tentacles. Latter the corrosion product cracks, laminates and falls off, so that it does not give resistance to the future corrosion. XRD result shows that the corrosion products are mainly composed of amorphous oxide of Sn and a few SnCl₂·2H₂O. The addition of trace Ga in the Sn–0.7Cu alloy can significantly improve the corrosion resistance of the alloy in the salt spray test. XPS result shows that trace Ga segregated highly on surface and existed a protective oxide film that can improve the corrosion resistance of the Sn–0.7Cu alloy.

Key words: Sn–0.7Cu pitting corrosion salt spray corrosion lead–free solder

Received: 06 April 2011

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Supported by Projects of Strategy Cooperation Between Guangdong Province and Chinese Academy of Science (No.2009B091300039)

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https://www.ams.org.cn/EN/10.3724/SP.J.1037.2011.00201 OR https://www.ams.org.cn/EN/Y2011/V47/I10/1327

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