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| EFFECTS OF HEAT-TREAT TEMPERATURE ON MICROSTRUCTURE OF ELECTRO-BRUSH PLATING Ni-P COATINGS |
| LI Zhiming, QIAN Shiqiang, WANG Wei, LIU Jihua |
| College of Material Engineering, Shanghai University of Engineering Science, Shanghai 201620 |
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Cite this article:
LI Zhiming QIAN Shiqiang WANG Wei LIU Jihua. EFFECTS OF HEAT-TREAT TEMPERATURE ON MICROSTRUCTURE OF ELECTRO-BRUSH PLATING Ni-P COATINGS. Acta Metall Sin, 2010, 46(7): 867-872.
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Abstract The effects of heat-treat temperature on the structural of electro-brush plating Ni-P coatings were investigated using X-ray diffraction (XRD) analysis. The results show that the eletro-brush plating Ni-P coating is mainly in amorphous state. When heat-treat temperature above 350 ℃, Ni and Ni3P crystal appear, NiO is generated as the heat-treat temperature is above 500 ℃. There is a typical S-shaped relationship between the crystallinity and heat-treat temperature. The activation energy of crystallization is (237.9±10.46) kJ±mol-1. As the heat-treat temperature rises, Ni crystal cell parameter a increases firstly and then decreases, Ni3P crystal cell parameter a decreases but $c$ has a little increase. The crystal size of both Ni and Ni3P has some increase with the rise of heat-treat temperature. The activation energies for the growth of Ni and Ni3P are (66.85$\pm$3.15) kJ?mol-1 and (133.41±4.69) kJ?mol-1, respectively, and the great disparity imply that Ni crystal has dynamic for preferred growth.\par
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Received: 11 February 2010
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| Fund: Supported by Special Project of Shanghai Nano--technology (No.0852nm01400) and Shanghai Leading Academic Discipline Project (No.J51402) |
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