EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR  OF Sn-3.5Ag/Cu SYSTEM

doi:10.3724/SP.J.1037.2009.00566

Acta Metall Sin

2010, Vol. 46

Issue (5): 569-574 DOI: 10.3724/SP.J.1037.2009.00566

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EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR OF Sn-3.5Ag/Cu SYSTEM

ZHOU Minbo; LI Xunping; MA Xiao; ZHANG Xinping

School of Materials Science and Engineering; South China University of Technology; Guangzhou 510640

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ZHOU Minbo LI Xunping MA Xiao ZHANG Xinping. EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR OF Sn-3.5Ag/Cu SYSTEM. Acta Metall Sin, 2010, 46(5): 569-574.

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Abstract

For electronic packaging technologies using lead-free solders, one of the major problems related to reliability for the solder interconnects is the existence of the interfacial intermetallic compound (IMC). The interfacial failures between IMC and solder alloy often lead to loss of function in interconnects and result in product failure. Therefore, considerable attention has been focused on study of formation, growth and control of IMC during solder process. In this paper, the early interfacial reaction in Sn-3.5Ag/Cu (UBM) system and the system's melting and solidification characteristics were investigated using differential scanning calorimeter incorporating with reflow process. The results show that during heating the diffusion of Cu atom into Sn-3.5Ag solder results in the formation of Sn-Ag-Cu ternary alloy at the interface before melting of Sn-3.5Ag solder and the ternary eutectic system melts at a temperature nearly 4 ℃ lower than Sn-3.5Ag solder's melting temperature. The early interfacial reaction also leads to earlier wetting of the liquid solder alloy at the interface, and consequently brings about formation of scallop-type Cu-Sn intermetallics layer with a certain thickness as well as makes the initial Sn-3.5Ag/Cu system changed into Sn-Ag-Cu/Cu system, which makes the undercooling of the solder alloy decrease obviously.

Key words: lead-free solder interfacial reaction intermetallics undercooling

Received: 31 August 2009

Fund:

Supported by Program of New Century Excellent Talents in University (No.NCET-04-0824) and Science and Technology Major Project of Guangdong Province (No.2009A080204005)

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https://www.ams.org.cn/EN/10.3724/SP.J.1037.2009.00566 OR https://www.ams.org.cn/EN/Y2010/V46/I5/569

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