A Review on Metal Micro-Nanostructured Array Materials Routed by Template-Free Electrodeposition

doi:10.11900/0412.1961.2021.00522

Acta Metall Sin

2022, Vol. 58

Issue (4): 486-502 DOI: 10.11900/0412.1961.2021.00522

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A Review on Metal Micro-Nanostructured Array Materials Routed by Template-Free Electrodeposition

HANG Tao, XUE Qi, LI Ming(

)

School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

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HANG Tao, XUE Qi, LI Ming. A Review on Metal Micro-Nanostructured Array Materials Routed by Template-Free Electrodeposition. Acta Metall Sin, 2022, 58(4): 486-502.

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Abstract

Due to their unique structure and physicochemical properties, metal micro-nanostructured array materials are commonly used in optics, magnetism, electricity, catalysis, and other fields. The preparation of metal micro-nanostructured array materials by electrochemical technology has the advantages of high controllability, simple preparation without a template, and large-scale production, giving it broad application prospects. This review systematically summarizes the recent progress in the field of preparing metal micro-nanostructured array materials using electrochemical technology, combining recent work by the author's team. Furthermore, this review also introduces and comments on the feasibility of electrochemical methods without a template, the research status and formation mechanism of metal micro-nanostructured array materials, the application status of metal micro-nanostructured array in various fields, and future development challenges. This review is expected to serve as a useful source of reference and educational tool for future research in this field, thereby promoting the application and development of this template-free electrodeposition method.

Key words: template-free electrodeposition metal micro-nanostructured array

Received: 01 December 2021

ZTFLH:

TQ153

Fund: National Natural Science Foundation of China(21972091)

About author: LI Ming, professor, Tel: (021)34202740, E-mail: mingli90@sjtu.edu.cn

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https://www.ams.org.cn/EN/10.11900/0412.1961.2021.00522 OR https://www.ams.org.cn/EN/Y2022/V58/I4/486

Fig.1 The crystal growth of different surfaces with different velocities (a), and the effect of crystallization agent with high concentration (b) and low concentration (c) on the aspect ratio of nanocone

Fig.2 Ni^[14] (a), Co^[15] (b), Cu^[17] (c), and Ni-Co^[16] (d) nanocone array materials deposited by the electrochemical method; and the schematic diagram of metal Ni nanocone array growth (e)

Fig.3 The metal nanoplate (NP) array materials of Ag^[31,32] (a, b), Co^[22,33] (c, d), Pd^[34] (e), and Rh^[36] (f) synthetized by electrochemical method (ITO—indium tin oxide; insets in Figs.3a, b, and e are the local magnified SEM images)

Fig.4 Pd^[43] (a), Pd-Ni^[44] (b), Co^[45] (c), Cu^[46] (d) nanowires, and Pd nanorod^[47] (e) deposited by the electrochemical method (Insets in Fig.4d are the local magnified SEM images; inset in Fig.4e shows the pentagonal projection of a Pb nanorod)

Fig.5 Pt^[48,49] (a, b), Au^[51] (c), Ag^[52,53] (d, e), and Bi^[54] (f) nanoflowers deposited by the electrochemical method; and the schematic illustration of Pt nanoflower growth^[49] (g) (Insets are the local magnified SEM images)

Fig.6 SEM images of electrodeposited Ni nanocone array (a) and Ni nanocone array supported Si electrode (b)^[61], schematic diagram illustrating the fabrication process of a nickel nanocone-array supported silicon anode architecture (c, d)^[63], and SEM images of electrodeposited Co nanomountain array (e) and Co nanomountain array supported Si electrode (f)^[64] (Inset in Fig.6a is the local magnified SEM image; inset in Fig.6b is the cross-sectional SEM image)

Fig.7 SEM image of Cu-Ni nanocone hierarchical structures (a) and the cathodic current-potential curves in hydrogen evolution reaction (HER) for the three hierarchical structures and the flat Ni (b)^[75], and cyclic voltammetry (CV) curves of Pt nanoflowers (curve a) and Pt nanoparticles (curve b) in 1.0 mol/L CH₃OH + 0.5 mol/L H₂SO₄ solution (c) and chronoamperometric curves of Pt nanoflowers (curve a) and Pt nanoparticles (curve b) at 0.6 V (vs SCE) in 1.0 mol/L CH₃OH + 0.5 mol/L H₂SO₄ solution (d)^[48](i—current density)

Fig.8 The superhydrophobic surface and SEM image (inset) of Au nanoflower prepared by electrodeposited (a)^[51], the superhydrophobicity and SEM image (inset) of Au-Ni nanocone array (b)^[85], optical graphs of a water droplet (4 mL) on the nickel film of nanocones structure (c)^[80], and schematic showing wetting of the four different surfaces fabricated (d)^[80]

Fig.9 Analyses of 3D micro/nano array materials by SEM and SERS (SERS—surface-enhanced Raman scattering)
(a) Raman spectra of R6G (Rhodamine 6G) on different substrates (Curve 1: Ag nanoparticle film; curves 2-4: Ag nanoplate arrays with varied density)^[38]
(b) SERS spectra of R6G aqueous solution absorbed on the surface of Ag nanoflower and Ag nanoparticles^[53]
(c) SEM image of Au nanoparticles supported by Ni nanocone (Au NPs@Ni NC) structure with Au deposition time of 120 s^[89]
(d) SERS spectra of 10^-6 mol/L R6G on Au NPs@Ni NCAs structure with Au deposition time of 60 and 120 s^[89]
(e) SEM image of Au nanoball supported by Ni nanocone (Au NB@Ni NC) with Au deposition at 0.1 ASD (A/dm²) (Inset is the local magnified SEM image)^[60]
(f) Raman spectra of 10^-6 mol/L CV-ethanol solution on Au NB@Ni NC and Au nanoball supported by Ni film (Au@Ni film)^[60]

Fig.10 The bonding method and interface mechanism of micro-nanocone array
(a) schematic of nano-serrated palladium pre-plated frame (Pd PPF)^[90]
(b, c) SEM images of the interface between nanocones array Pd PPF and molding compound^[90] (EMC—epoxy molding compound)
(d, g, j, m) schematics of micro-nanocone array bonding and graphene coating micro-nanocone array with Sn-capped Cu bumps (d)^[91], soft solder (g, j)^[92,97], and Au wire (m)^[96]
(e, f, h, i, n) cross-section images of micro-nanocone array bonding with Sn-capped Cu bumps (e, f)^[91], Sn-3.0Ag-0.5Cu solder (h)^[92], Sn solder (i)^[93], and Au wire (n)^[96] (Inset in Fig.10i is the TEM image of the Ni-Sn bonding interface)
(k, l) aging behavior comparison between Sn-Cu and Sn-graphene-Cu bonds at 150^oC for 96 h^[97]

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