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NANOHARDNESS AND ELASTIC MODULUS MEASUREMENT OF THIN FILM MATERIAL SURFACE WITH THE QUASICONTINUUM METHOD |
;JIANG Wu-Gui |
南昌航空工业学院材料学院;清华大学工程力学系 |
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Cite this article:
JIANG Wu-Gui. NANOHARDNESS AND ELASTIC MODULUS MEASUREMENT OF THIN FILM MATERIAL SURFACE WITH THE QUASICONTINUUM METHOD. Acta Metall Sin, 2007, 43(8): 851-856 .
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Abstract Quasicontinuum simulations were performed to study the feature of plastic deformation in the initial stage of nanoindentation test of single crystal aluminium and single crystal copper using rigid cylindrical indenter. The corresponding load-depth loading and unloading curves at different depths were obtained. The contact stiffness, nanohardness and elastic modulus both single crystal aluminium and single crystal copper at different depths were calculated by Oliver-Pharr method. The calculated results using quasicontinuum method were compared with nanoindentation experiments published. The results show that the contact stiffness-displacement relations both single crystal aluminium and single crystal copper are linear. The simulated results indicate that the size effect phenomenon exist in nanohardness measurement both single crystal aluminium and single crystal copper. The nanohardnesses of them are 0.584±0.013GPa and 0.755±0.027GPa, respectively. Size effect phenomenon don’t exist in elastic modulus measurement both single crystal aluminium and single crystal copper. The elastic moduluses of them are 84.088±0.332GPa and 131.833±4.449GPa, respectively. The results calculated using the quasicontinuum method agree with the nanoindentation experiments, indicating that it is reliable and valid to measure the nanohardness and elastic modulus by using this approach.
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Received: 09 November 2006
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