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Acta Metall Sin  1994, Vol. 30 Issue (4): 164-169    DOI:
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ISOTHERMAL SHEAR LOW-CYCLE FATIGUE BEHAVIOUR OF 62Sn-36Pb-2Ag SURFACE MOUNT SOLDER JOINTS
LI Yunqing; TANG Xiangyun; M A Jusheng; HUANG Le(Tsinghua University; Beijing)(Manuscript received 19 July; 1993: in revised form 18 October; 1993)
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LI Yunqing; TANG Xiangyun; M A Jusheng; HUANG Le(Tsinghua University; Beijing)(Manuscript received 19 July; 1993: in revised form 18 October; 1993). ISOTHERMAL SHEAR LOW-CYCLE FATIGUE BEHAVIOUR OF 62Sn-36Pb-2Ag SURFACE MOUNT SOLDER JOINTS. Acta Metall Sin, 1994, 30(4): 164-169.

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Abstract  The isothermal low-cycle fatigue behaviour of 62Sn-36Pb-2Ag surface mount solder joint under shear stress has been discussed, meanwhile, the curve of shear fatigue life vs cyclic shear stress amplitude has been obtained, and the failure mechanism under different shear stress amplitude at different temperatures is analyzed. The results show that:there are obvious cyclic creep behaviour during constant stress amplitude low-cycle fatigue in 62Sn-36Pb-2Ag surface mount solder joints. The failure of solder joint is due to the interaction of fatigue and creep. At 25℃, under low shear stress amplitude, the failure is controlled mainly by fatigue mechanism, in constrast, under high shear stress amplitude, controlled mainly by creep mechanism:the failure mechanism at 100℃ is similar to that at 25℃ , only the transfer stress τ_(+) from fatigue mechanism to creep mechanism is lower than that at 25℃. Under similar relatative shear stress amplitude (τ_(+)/τ_b and τ_(+)/τ_b'), the fatigue rack propagation rate da / dN at 100℃ is similar to that at 25℃ .Correspondent: LI Yunqing, lecturer, Department of Materials Science and Engineering, Tsinghua University,Beijing 100084
Key words:  surface mount packaging      solder joint      low-cycle fatigue      cyclic creep      failure mechanism     
Received:  18 April 1994     
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